Datasheet

LTM2881
23
2881fg
For more information www.linear.com/LTM2881
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 3/10 Changes to Features, Description and Typical Application
Add BGA Package to Pin Configuration, Order Information and Package Description Sections
Changes to LGA Package in Pin Configuration Section
Changes to Electrical Characteristics Section
Changes to Graphs G09, G13, G14
Update to Pin Functions
Update to Applications Information
Change to X-Axis on Figures 9a and 9b
Update to Supply Current Section
“PCB Layout Isolation Considerations” Section Replaced
RF, Magnetic Field Immunity Section Added
Changes to Related Parts
1
2, 19
2
3
6, 7
8
12
13
14
15
16
22
B 8/10 H-Grade parts added. Reflected throughout the data sheet. 1-22
C 5/11 HV-Grade parts removed. Reflected throughout the data sheet.
Updated the PCB Layout section.
Updated the Related Parts.
1-24
15, 16, 17
24
D 1/12 HV and MPY parts added. Reflected throughout the data sheet. 1-24
E 4/12 Added H/MP-Grade condition for I
OZD
Corrected Figure 15
3
15
F 2/13 Storage Temperature Range corrected 2
G 4/14 Added lead finish part numbers
Added CTI and DTI parameters
3
6