User's Manual
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ORDERING INFORMATION
- MODULE ACCESSORIES
- BLOCK DIAGRAM
- DEVELOPMENT KIT
- MODULE PINOUT AND PIN DESCRIPTIONS
- MODULE OVERVIEW
- OPERATING MODES TRUTH TABLE
- MODES OF OPERATION
- DEVELOPMENT TOOLS
- ELECTRICAL SPECIFICATIONS
- SOLDERING RECOMMENDATIONS
- CLEANING
- OPTICAL INSPECTION
- REWORK
- SHIPPING, HANDLING, AND STORAGE
- AGENCY STATEMENTS
- MECHANICAL DATA
- COMPATIBILITY
- MODULE REVISION HISTORY
- CONTACTING LS RESEARCH
SiFLEX02-HP TRANSCEIVER MODULE
DATASHEET
The information in this document is subject to change without notice.
Confirm the data is current by downloading the latest revision from www.lsr.com.
330-0047-R0.7 Copyright © 2010-2011 LS Research, LLC Page 24 of 35
SOLDERING RECOMMENDATIONS
Recommended Reflow Profile for Lead Free Solder
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the
host board should meet the appropriate IPC Specification. See IPC-A-610-D Acceptability
of Electronic Assemblies, section 8.2.4 Castellated Terminations.”