Datasheet
30© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2076_T52X-530 • 4/16/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
30
KEMET Organic Capacitor (KO-CAP
®
)
T52x/T530 Polymer Electrolytic Capacitors
Soldering Process
The KEMET families of surface mount capacitors are
compatible with wave (single or dual), convection, IR,
or vapor phase reow techniques. Preheating of these
components is recommended to avoid extreme thermal
stress. KEMET's recommended prole conditions for
convection and IR reow reect the prole conditions of the
IPC/J–STD–020D standard for moisture sensitivity testing.
The devices can safely withstand a maximum of three reow
passes at these conditions.
Please note that although the X/7343–43 case size can
withstand wave soldering, the tall prole (4.3 mm maximum)
dictates care in wave process development.
Hand soldering should be performed with care due to the
diculty in process control. If performed, care should be
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad,
applying solder between the pad and the termination, until
reow occurs. Once reow occurs, the iron should be
removed immediately. “Wiping” the edges of a chip and
heating the top surface is not recommended.
Prole Feature SnPb Assembly
Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T
Smin
) 100°C 150°C
Temperature Maximum (T
Smax
) 150°C 200°C
Time (t
s
) from T
smin
to T
smax
) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T
L
to T
P
) 3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (T
L
) 183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T
P
)
220°C*
235°C**
250°C*
260°C**
Time within 5°C of Maximum
Peak Temperature (t
P
)
20 seconds maximum 30 seconds maximum
Ramp-down Rate (T
P
to T
L
) 6°C/seconds maximum 6°C/seconds maximum
Time 25°C to Peak
Temperature
6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reow.
* For Case Size height > 2.5 mm
** For Case Size height ≤ 2.5 mm
Storage
All KO-CAP Series are shipped in moisture barrier bags (MBBs) with desiccant and humidity indicator card (HIC). These
parts are classied as MSL3 (Moisture Sensitivity Level 3) per IPC/JEDEC J–STD–020 and packaged per IPC/JEDEC
J–STD–033. MSL3 species a oor time of 168H at 30°C maximum temperature and 60% relative humidity. Unused
capacitors should be sealed in a MBB with fresh desiccant.
The calculated shelf life in a sealed bag would be 12 months from a bag seal date in a storage environment of < 40°C and
humidity < 90% RH. It should be 24 months from a bag seal date in a storage environment of < 30°C and humidity < 70% RH.
If baking is required, refer to IPC/JEDEC J–STD–033 for bake procedure.
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
t
P
t
L
t
s
25°C to Peak