Datasheet

18© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard T2008_T494 • 8/20/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
18
Tantalum Surface Mount Capacitors – Low ESR
T494 Industrial Grade MnO
2
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1, Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 4 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
D
1
Minimum
Note1
E
1
P
0
P
2
R Reference
Note2
S
1
Minimum
Note3
T Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059
+0.004/−0.0)
1.0
(0.039)
1.75 ±0.10
(0.069±0.004)
4.0 ±0.10
(0.157±0.004)
2.0 ±0.05
(0.079±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note4
E
2
Minimum F P
1
T
2
Maximum W Maximum A
0
, B
0
& K
0
8 mm Single(4mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138±0.002)
2.0 ±0.05 or 4.0 ±0.10
(0.079±0.002or0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note5
12 mm
Single(4mm)
and Double
(8mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217±0.002)
2.0±0.05(0.079±0.002)or
4.0±0.10(0.157±0.004)or
8.0±0.10(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 4).
3. If S
1
< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).
4. B
1
dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A
0
, B
0
and K
0
shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3).
(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.