Datasheet

11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3123_R52_X2_310_110C_MIN 8/5/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Metallized Polypropylene Film EMI Suppression Capacitors for Harsh Environmental Conditions
R52 (Miniature), Class X2, 310 VAC, 110°C (Automotive Grade)
Soldering Process cont.
Wave Soldering Recommendations cont.
1.Thetableindicatesthemaximumset-uptemperatureofthesolderingprocess.
Dielectric
Film Material
Maximum
Preheat
Temperature
Maximum
Peak Soldering
Temperature
Capacitor
Pitch
≤15mm
Capacitor
Pitch
> 15 mm
Capacitor
Pitch
≤15mm
Capacitor
Pitch
> 15 mm
Polyester 130°C 130°C 270°C 270°C
Polypropylene 110°C 130°C 260°C 270°C
Paper 130°C 140°C 270°C 270°C
Polyphenylene
Sulphide
150°C 160°C 270°C 270°C
2.Themaximumtemperaturemeasuredinsidethecapacitor:setthetemperaturesothatthemaximumtemperatureinside
theelementisbelowthelimit.
Dielectric Film Material
Maximum Temperature
Measured Inside the Element
Polyester 160°C
Polypropylene 110°C
Paper 160°C
Polyphenylene Sulphide 160°C
Temperature monitored inside the capacitor.
Selective Soldering Recommendations
Selectivedipsolderingisavariationofreowsoldering.Inthismethod,theprintedcircuitboardwiththrough-hole
componentstobesolderedispreheatedandtransportedoverthesolderbathasitisinnormalowsoldering,without
touchingthesolder.Whentheboardisoverthebath,itisstopped.Pre-designedsolderpotsareliftedfromthebathwith
moltensolder,onlyattheplacesoftheselectedcomponents,andpressedagainstthelowersurfaceoftheboardtosolder
the components.
Thetemperatureproleforselectivesolderingissimilartothedoublewaveowsolderingoutlinedinthisdocument.
However, instead of two baths, there is only one with a time from 3 – 10 seconds. In selective soldering, the risk of
overheatingisgreaterthanindoublewaveowsoldering,andgreatcaremustbetakensothatthepartsdonotoverheat.