Datasheet

15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3093_R46_X2_275_110C • 2/5/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Metallized Polypropylene Film EMI Suppression Capacitors
R46 Series, Class X2, 275 VAC, 110°C
Lead Taping & Packaging (IEC 60286–2)
Taping Speci cation
Description Symbol
Dimensions (mm)
Lead Space
Tol.
10
15
22.5
27.5
Fig. 1
Fig. 2
Fig. 3
Fig. 3
Lead wire diameter d 0.6 0.6–0.8 0.8 0.8 ±0.05
Taping lead space P 25.4 25.4 38.1 38.1 ±1
Feedholeleadspace* P
0
12.7 12.7 12.7 12.7 ±0.2**
Centering of the lead wire P
1
7.7 5.2 7.8 5.3 ±0.7
Centeringofthebody P
2
12.7 12.7 19.05 19.05 ±1.3
Leadspacing(pitch)*** F 10 15 22.5 27.5 +0.6/−0.1
Component alignment ∆h 0 0 0 0 ±2
Height of component
from tape center
H
0
**** 18.5 18.5 18.5 18.5 ±0.5
Carrier tape width W 18 18 18 18 +1/−0.5
Hold down tape width W
0
9 10 10 10 Minimum
Hole position W
1
9 9 9 9 ±0.5
Hold down tape position W
2
3 3 3 3 Maximum
Feed hole diameter D
0
4 4 4 4 ±0.2
Total tape thickness t 0.7 0.7 0.7 0.7 ±0.2
* 15 mm also available
** Maximum of 1 mm on 20 lead spaces
*** Pitches 15 mm and 10 mm taped to 7.5 mm (crimped leads) available upon request
**** H
0
= 16.5 mm is available upon request
P
P
2
P
0
F
H
0
W
h
P
1
D
0
W
2
W
1
W
0
h
ød
P
P
2
P
1
Figure 1
Lead Spacing 10 mm
Figure 2
Lead Spacing 15 mm
Figure 3
Lead Spacing 22.5 – 27.5 mm
t
A-B
A B