Datasheet
31© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard FS8004_NSS • 9/9/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
FLEX SUPPRESSOR
®
Noise Suppression Sheet
Soldering Process
230
200
150
Preheating
A
B
Peak Temperature (°C)
Time (seconds)
Reflow Profile
Peak Temperature +260°C
Preheating 150–180°C90secondsmaximum
A 200°Cormore,60secondsmaximum
B 230°Cormore,40secondsmaximum
Number of Times 2timesmaximum
Allnoisesuppressionsheetsarereowcapable,ifusedwithspecialdouble-sidedadhesivetape.
Available upon request. Please contact KEMET respresentative for more details.
Handling Precautions
Avoid high temperature, humidity and direct sunlight. Storage environment should be below 40°C and below 70% relative
humidity.
The surface resistance value listed in this catalog is a reference value of the circuit parameter to indicate noise
suppression. The value does not represent the product’s insulation characteristics. The value may become lower if an
excesspressureisappliedtotheproduct.
The products in this datasheet are not insulators, they need to be handled as conductors. Care must be taken when in use,
so that conductive material does not contact the surface or the edge of the FLEX SUPPRESSOR sheet. Insulation process
should be performed when contact to conductive material is probable.
Depending on the processing procedure, powdery substance may drop out from sheet surface or the edge, if the cutting
of the sheet is performed. Depending on the location, care must be taken, as this powder may effect the component’s
performance.
Any dust, oil or moisture must be cleaned from the surface of the installation area when using an adhesive tape to attach
the sheet.
Theadhesivetapemaybegintolosesomeofitsadhesivenessafterbeinginstorageforsixmonths.Thishasnoimpacton
theEMIlteringeffectiveness.