Datasheet
9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1105_KONNEKT_KC-Link_C0G • 5/20/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Eciency, High-Density Power Applications (Commercial Grade)
Table 3 – KONNEKT Land Pattern Design Recommendations per IPC-7351 (mm)
Chip
Number
Orientation
EIA SIZE
CODE
METRIC
SIZE CODE
Median (Nominal) Land
Protrusion
C
Y
X
V1
V2
2 Standard
3640 9210
4.35 1.5 10.6 10.7 11.1
3
Standard 4.35 1.5 10.6 10.7 11.1
Low Loss 4.35 1.5 8.3 10.7 8.8
4
Standard 4.35 1.5 10.6 10.7 11.1
Low Loss 4.35 1.5 10.7 10.7 11.2
KONNEKT 3640 2-Chip
Standard Low Loss
(Land Pattern Design Recommendations per IPC-7351, top view)
Not available in Low Loss
KONNEKT 3640 3-Chip
Standard Low Loss
(Land Pattern Design Recommendations per IPC-7351, top view)
KONNEKT 3640 4-Chip
Standard Low Loss
(Land Pattern Design Recommendations per IPC-7351, top view)