Datasheet

3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1105_KONNEKT_KC-Link_C0G • 5/20/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Eciency, High-Density Power Applications (Commercial Grade)
Orientation and Packaging (Sux/C-Spec) Options Table
Mounting Orientation
1
Tape and Reel
Illustration
Packaging Type
Packaging/Grade
Ordering Code (C-Spec)
Standard
7" Reel/Unmarked
TU (7800)
13" Reel/Unmarked 7210
Low Loss
7" Reel/Unmarked
7805
13" Reel/Unmarked 7810
1
Orientation refers to the positioning of the KONNEKT capacitors in the Tape and Reel pockets. This allows pick and place machines to place capacitors
on the PCB in the correct orientation.
Dimensions – Millimeters (Inches)
Standard Mounting
2 Chips
Standard Mounting
3 Chips
Low Loss Mounting
3 Chips
Standard Mounting
4 Chips
Low Loss Mounting
4 Chips
B
T
W
L
B
T
W
L
B
T
W
L
B
T
W
L
B
T
W
L
Number
of Chips
Mounting
EIA
SIZE
CODE
METRIC
SIZE
CODE
L
LENGTH
W
WIDTH
T
THICKNESS
B
BANDWIDTH
Mounting
Technique
Typical
Average
Piece Weight
(g)
2 Standard
3640 9210
9.30 (0.366)
±0.60 (0.024)
10.20 (0.402)
±0.40 (0.016)
5.10 (0.201)
±0.40 (0.016)
1.27 (0.050)
±0.40 (0.016)
Solder Reow
Only
2.2
3
Standard
10.20 (0.402)
±0.40 (0.016)
7.70 (0.303)
±0.60 (0.24)
3.3
Low Loss
7.70 (0.303)
±0.60 (0.24)
10.20 (0.402)
±0.40 (0.016)
3.3
4
Standard
10.20 (0.402)
±0.40 (0.016)
10.30 (0.405)
±0.80 (0.031)
4.3
Low Loss
10.30 (0.405)
±0.80 (0.031)
10.20 (0.402)
±0.40 (0.016)
4.3