Datasheet

12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1105_KONNEKT_KC-Link_C0G • 5/20/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Eciency, High-Density Power Applications (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance
with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table
1B for details on reeling quantities for commercial chips.
16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed
plastic carrier
Embossment
cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
KONNEKT
Standard
orientation
in pocket
Embossed
plastic carrier
KONNEKT
Low loss
orientation
in pocket
KEMET
®
Bar code label
Sprocket
holes
Table 4 – Carrier Tape Con guration, Embossed Plastic (mm)
EIA Case Size
Chip
Number
Tape Size
(W)*
Embossed Plastic
7" Reel 13" Reel
Pitch (P
1
)
2
KONNEKT 3640
2
24
20 20
3 20 20
4 24 24
1. Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
2. Refer to Tables 4 and 5 for tolerance specifi cations.