Datasheet

15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1105_KONNEKT_KC-Link_C0G • 5/20/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Eciency, High-Density Power Applications (Commercial Grade)
Figure 5 – Reel Dimensions
A
D (See Note)
Full Radius,
See Note
B (see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum C D Minimum
24 mm
178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059)
13.0+0.5/−0.2
(0.521+0.02/−0.008)
20.2
(0.795)
Variable Dimensions — Millimeters (Inches)
Tape Size
N Minimum
See Note 2, Tables 2-3
W
1
W
2
Maximum W
3
24 mm
50
(1.969)
25+1.0/−0.0
(0.984+0.039/−0.0)
27.4+1.0/−1.0
(1.078+0.039/−0.039)
Shall accommodate tape
width without interference