Datasheet

10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1105_KONNEKT_KC-Link_C0G • 5/20/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Eciency, High-Density Power Applications (Commercial Grade)
Soldering Process
Recommended Reow Soldering Prole
KEMET's KONNEKT family of high density surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with
convection and IR reow techniques. Preheating of these components is recommended to avoid extreme thermal stress.
KEMET’s recommended prole conditions for convection and IR reow reect the prole conditions of the IPC/J-STD-020
standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reow passes at these
conditions.
Prole Feature
Termination Finish
100% matte Sn
Preheat/Soak
Temperature Minimum (T
Smin
)
150°C
Temperature Maximum (T
Smax
) 200°C
Time (t
S
) from T
Smin
to T
Smax
60 – 120 seconds
Ramp-Up Rate (T
L
to T
P
) 3°C/second maximum
Liquidous Temperature (T
L
) 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds
Peak Temperature (T
P
) 260°C
Time Within 5°C of Maximum Peak
Temperature (t
P
)
30 seconds maximum
Ramp-Down Rate (T
P
to T
L
) 6°C/second maximum
Time 25°C to Peak Temperature 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
t
P
t
L
t
s
25°C to Peak
Hand Soldering and Removal of KONNEKT Capacitors
The preferred method of attachment for KEMET’s KONNEKT Capacitors is IR or convection reow where temperature, time
and air ow are well controlled.
However, it is understood that the manual attachment of KONNEKT capacitors is necessary for prototype and lab testing. In
these instances, care must be taken not to introduce excessive temperature gradients in the KONNEKT part type that may
lead to cracking in the ceramic or separation of the TLPS material.
Please see KEMET's KONNEKT Soldering Guidelines here.