Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3114_C4AQ • 2/6/2018 12
Power and AC Film Capacitors – Printed Circuit Board Mount Power Film Capacitors
C4AQ, Radial, 2 or 4 Leads, 500 - 1,500 VDC, for DC Link (Automotive Grade)
Manual Soldering Recommendations
Following is the recommendation for manual
soldering with a soldering iron.
The soldering iron tip temperature should
be set at 350°C (+10°C maximum) with the
soldering duration not to exceed more than 3
seconds.
Recommended Soldering Temperature
0
50
100
150
200
250
300
350
400
0 1 2 3 4 5 6 7 8
Soldering time (seconds)
Soldering iron bit temperature (°C)
Soldering Process
The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder.
This has increased the liquidus temperature from that of 183°C for SnPb eutectic alloy to 217 – 221°C for the new alloys. As a
result, the heat stress to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave
temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 – 170°C). Wave
soldering can be destructive, especially for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm),
and great care has to be taken during soldering. The recommended solder proles from KEMET should be used. Please consult
KEMET with any questions. In general, the wave soldering curve from IEC Publication 61760-1 Edition 2 serves as a solid guideline
for successful soldering. Please see Figure 1.
Reow soldering is not recommended for through-hole lm capacitors. Exposing capacitors to a soldering prole in excess of the
above the recommended limits may result to degradation or permanent damage to the capacitors.
Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert
through-hole parts after the curing of surface mount parts. Consult KEMET to discuss the actual temperature prole in the oven,
if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended.
Please allow time for the capacitor surface temperature to return to a normal temperature before the second soldering cycle.
Wave Soldering Recommendations
0
50
100
150
200
250
300
0
40
80
120
160
200
240
Temperature (°C)
Time (s)
ca 2°C/second
ca 3.5°C/second typical
ca 5°C/second
Cooling
2 +3 seconds maximum
115 °C max
T
preheat
∆T < 150°C
100 °C
Preheating
Typical
First wave
Second wave
260°C