Datasheet
13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard F3116_C4AF • 7/29/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Power and AC Film Capacitors – Printed Circuit Board Mount Power Film Capacitors
C4AF, Radial, 2 or 4 Leads, 250 - 500 VAC, for Harsh Environment AC Filtering (Automotive Grade)
Soldering Process cont.
Wave Soldering Recommendations cont.
1. The tables indicates the maximum set-up temperature of the soldering process
Dielectric Film
Material
Maximum Preheat
Temperature
Maximum
Peak Soldering
Temperature
Capacitor
Pitch
≤ 15 mm
Capacitor
Pitch
> 15 mm
Capacitor
Pitch
≤ 15 mm
Capacitor
Pitch
> 15 mm
Polyester 130°C 130°C 270°C 270°C
Polypropylene 110°C 130°C 260°C 270°C
Paper 130°C 140°C 270°C 270°C
Polyphenylene
Sulphide
150°C 160°C 270°C 270°C
2. The maximum temperature measured inside the capacitor: set the temperature so that inside the element the maximum
temperature is below the limit.
Dielectric Film Material
Maximum Temperature
Measured Inside the Element
Polyester 160°C
Polypropylene 110°C
Paper 160°C
Polyphenylene Sulphide 160°C
Temperature monitored inside the capacitor.
Selective Soldering Recommendations
Selective dip soldering is a variation of reow soldering. In this method, the printed circuit board with through-hole
components to be soldered is pre-heated and transported over the solder bath, as in normal ow soldering, without touching
the solder. When the board is over the bath, it is stopped. Pre-designed solder pots are lifted from the bath with molten
solder, only at the places of the selected components, and pressed against the lower surface of the board to solder the
components.
The temperature prole for selective soldering is similar to the double wave ow soldering outlined in this document.
However, instead of two baths, there is only one with a time from 3 – 10 seconds. In selective soldering, the risk of
overheating is greater than in double wave ow soldering, and great care must be taken so that the parts do not overheat.