Datasheet

16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1054_HV_GOLDMAX_300_C0G • 8/20/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Radial Leaded Multilayer Ceramic Capacitors
High Voltage Goldmax, 300 Series, Conformally Coated, C0G Dielectric, 500 – 3,000 VDC (Commercial Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Solderability J–STD–002
Magnication 50X. Conditions:
a) Method A, at 235°C, Category 3
Temperature Cycling JESD22 Method JA-104 1,000 cycles (−55°C to +125°C), measurement at 24 hours ±4 hours after test conclusion.
Biased Humidity
MIL–STD–202
Method 103
Load humidity, 1,000 hours 85°C/85%RH and 200Vdc maximum. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
Low volt humidity, 1,000 hours 85C°/85%RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours ±4 hours after test conclusion.
Moisture Resistance
MIL–STD–202
Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours ±4
hours after test conclusion.
Thermal Shock
MIL–STD–202
Method 107
−55°C to +125°C. Note: Number of cycles required – 300. Maximum transfer time – 20
seconds. Dwell time – 15 minutes. Air – Air.
High Temperature Life
MIL–STD–202
Method 108/EIA–198
1,000 hours at 125°C with 1.2 X rated voltage applied.
Storage Life
MIL–STD–202
Method 108
125°C, 0 VDC for 1,000 hours.
Vibration
MIL–STD–202
Method 204
5 g for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8"X5" PCB .031" thick 7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz.
Resistance to Soldering
Heat
MIL–STD–202
Method 210
Condition B. No preheat of samples. Note: single wave solder – procedure 2.
Terminal Strength
MIL–STD–202
Method 211
Conditions A (454g), Condition C (227g)
Mechanical Shock
MIL–STD–202
Method 213
Figure 1 of Method 213, Condition C.
Resistance to Solvents
MIL–STD–202
Method 215
Add aqueous wash chemical – OKEM Clean or equivalent.
Storage & Handling
The un-mounted storage life of a leaded ceramic capacitor is dependent upon storage and atmospheric conditions as
well as packaging materials. While the ceramic chips enveloped under the epoxy coating themselves are quite robust
in most environments, solderability of the wire lead on the nal epoxy-coated product will be degraded by exposure to
high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be
degraded by high temperature and exposure to direct sunlight – reels may soften or warp, and tape peel force may increase.
KEMET recommends storing the un-mounted capacitors in their original packaging, in a location away from direct sunlight,
and where the temperature and relative humidity do not exceed 40 degrees centigrade and 70% respectively. For optimum
solderability, capacitor stock should be used promptly, preferably within 18 months of receipt. For applications requiring
pre-tinning of components, storage life may be extended if solderability is veried. Before cleaning, bonding or molding these
devices, it is important to verify that your process does not affect product quality and performance. KEMET recommends
testing and evaluating the performance of a cleaned, bonded or molded product prior to implementing and/or qualifying any
of these processes.