Datasheet
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1049_GOLDMAX_C0G • 10/22/2015 15
Radial Leaded Multilayer Ceramic Capacitors
Goldmax, 300 Series, Conformally Coated, C0G Dielectric, 50 – 200 VDC (Commercial Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Solderability J-STD-002
Magnication 50X. Conditions:
a) Method A, at 235°C, Category 3
Temperature Cycling JESD22 Method JA-104 1,000 cycles (-55°C to +125°C), measurement at 24 hours +/- 4 hours after test conclusion.
Biased Humidity MIL-STD-202 Method 103
Load humidity, 1,000 hours 85°C/85%RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 4 hours after test conclusion.
Low volt humidity, 1,000 hours 85C°/85%RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24
hours +/- 4 hours after test conclusion.
Moisture Resistance MIL-STD-202 Method 106
t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hours +/- 4 hours
after test conclusion.
Thermal Shock MIL-STD-202 Method 107
-55ºC to +125°C. Note: Number of cycles required = 300. Maximum transfer time = 20 seconds.
Dwell time -15 minutes. Air-Air.
High Temperature Life
MIL-STD-202 Method 108
/ EIA -198
1,000 hours at 125°C (85°C for Z5U) with 2 X rated voltage applied.
Storage Life MIL-STD-202 Method 108 125°C, 0 VDC for 1,000 hours.
Vibration MIL-STD-202 Method 204
5 g for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8"X5" PCB .031" thick 7 secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10-2000 Hz.
Resistance to Soldering
Heat
MIL-STD-202 Method 210 Condition B. No preheat of samples. Note: single wave solder – procedure 2.
Terminal Strength MIL-STD-202 Method 211 Conditions A (454g), Condition C (227g)
Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition C.
Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical – OKEM Clean or equivalent.
Storage & Handling
The un-mounted storage life of a leaded ceramic capacitor is dependent upon storage and atmospheric conditions as well as
packaging materials. While the ceramic chips enveloped under the epoxy coating themselves are quite robust in most environments,
solderability of the wire lead on the nal epoxy-coated product will be degraded by exposure to high temperatures, high humidity,
corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature and exposure to
direct sunlight – reels may soften or warp, and tape peel force may increase.
KEMET recommends storing the un-mounted capacitors in their original packaging, in a location away from direct sunlight, and where
the temperature and relative humidity do not exceed 40 degrees centigrade and 70% respectively. For optimum solderability, capacitor
stock should be used promptly, preferably within 18 months of receipt. For applications requiring pre-tinning of components, storage life
may be extended if solderability is veried. Before cleaning, bonding or molding these devices, it is important to verify that your process
does not affect product quality and performance. KEMET recommends testing and evaluating the performance of a cleaned, bonded or
molded product prior to implementing and/or qualifying any of these processes.