Datasheet
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1034_X7R_HV_ARC_SMD • 4/26/2018 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ArcShield Technology, High Voltage, X7R Dielectric, 500 – 1,000 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429
Board Flex JIS–C–6429
for C0G. Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Temperature Cycling JESD22 Method JA–104
Biased Humidity
MIL–STD–202
Method 103
Measurement at 24 hours ±4 hours after test conclusion.
Measurement at 24 hours ±4 hours after test conclusion.
Moisture Resistance
MIL–STD–202
Method 106
t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours ±4
hours after test conclusion.
Thermal Shock
MIL–STD–202
Method 107
seconds. Dwell time – 15 minutes. Air – air.
High Temperature Life
MIL–STD–202
Method 108
Storage Life
MIL–STD–202
Method 108
Vibration
MIL–STD–202
Method 204
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202
Method 213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MIL–STD–202
Method 215
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.