Datasheet
11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1105_KONNEKT_KC-Link_C0G • 5/20/2020
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ with KONNEKT™ Technology for High-Eciency, High-Density Power Applications (Commercial Grade)
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature uctuations should be minimized to avoid
condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within 1.5 years upon receipt.
Construction
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Dielectric Material
(CaZrO
3
)
Dielectric Material
(CaZrO
3
)
Termination Finish
(100% matte Sn)
Termination Finish
(100% matte Sn)
End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
Bonding Material
(See Image Below)
Bonding Material
MLCC
MLCC
CuSn TLPS