Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1003_C0G • 7/21/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
C0G Dielectric, 10 – 250 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
 •SolderwaveorsolderreowforEIAcasesizes0603,0805and1206
 •AllotherEIAcasesizesarelimitedtosolderreowonly
Recommended Reow Soldering Prole:
KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),
convection,IRorvaporphasereowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedproleconditionsforconvectionandIRreowreecttheproleconditionsoftheIPC/
J-STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereowpasses
attheseconditions.
Prole Feature
Termination Finish
SnPb 100%MatteSn
Preheat/Soak
TemperatureMinimum(T
Smin
)
100°C
150°C
TemperatureMaximum(T
Smax
) 150°C 200°C
Time (t
S
) from T
Smin
to T
Smax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (T
L
to T
P
)
3°C/second
maximum
3°C/second
maximum
LiquidousTemperature(T
L
) 183°C 217°C
TimeAboveLiquidous(t
L
) 60 – 150 seconds 60 – 150 seconds
PeakTemperature(T
P
) 235°C 260°C
TimeWithin5°CofMaximum
PeakTemperature(t
P
)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (T
P
to T
L
)
6°C/second
maximum
6°C/second
maximum
Time25°CtoPeak
Temperature
6minutes
maximum
8minutes
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
T
smin
25
T
smax
T
L
T
P
Maximum Ramp Up Rate = 3ºC/sec
Maximum Ramp Down Rate = 6ºC/sec
t
P
t
L
t
s
25ºC to Peak