Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com C1003_C0G • 3/30/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
 •SolderwaveorsolderreowforEIAcasesizes0603,0805and1206
 •AllotherEIAcasesizesarelimitedtosolderreowonly
Recommended Reow Soldering Prole:
KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),convection,
IRorvaporphasereowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermalstress.KEMET’s
recommendedproleconditionsforconvectionandIRreowreecttheproleconditionsoftheIPC/J-STD-020standardformoisture
sensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereowpassesattheseconditions.
Prole Feature
Termination Finish
SnPb 100%MatteSn
Preheat/Soak
TemperatureMinimum(T
Smin
)
100°C
150°C
TemperatureMaximum(T
Smax
) 150°C 200°C
Time (t
S
)fromT
Smin
to T
Smax
60–120seconds
60–120seconds
Ramp-Up Rate (T
L
to T
P
) 3°C/secondmaximum 3°C/secondmaximum
LiquidousTemperature(T
L
) 183°C 217°C
TimeAboveLiquidous(t
L
) 60–150seconds 60–150seconds
PeakTemperature(T
P
) 235°C 260°C
TimeWithin5°CofMaximum
PeakTemperature(t
P
)
20secondsmaximum 30secondsmaximum
Ramp-Down Rate (T
P
to T
L
) 6°C/secondmaximum 6°C/secondmaximum
Time25°CtoPeak
Temperature
6minutesmaximum 8minutesmaximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
T
smin
25° C to Peak
t
L
t
S
25
t
P
T
smax
T
L
T
P
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec