Datasheet
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 9/17/2015 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
•SolderwaveorsolderreowforEIAcasesizes0603,0805and1206
•AllotherEIAcasesizesarelimitedtosolderreowonly
Recommended Reow Soldering Prole:
KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),convection,
IRorvaporphasereowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermalstress.KEMET’s
recommendedproleconditionsforconvectionandIRreowreecttheproleconditionsoftheIPC/J-STD-020standardformoisture
sensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereowpassesattheseconditions.
Prole Feature
Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (T
Smin
)
100°C
150°C
Temperature Maximum (T
Smax
) 150°C 200°C
Time (t
S
) from T
Smin
to T
Smax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (T
L
to T
P
) 3°C/second maximum 3°C/second maximum
Liquidous Temperature (T
L
) 183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T
P
) 235°C 260°C
TimeWithin5°CofMaximum
Peak Temperature (t
P
)
20 seconds maximum 30 seconds maximum
Ramp-Down Rate (T
P
to T
L
) 6°C/second maximum 6°C/second maximum
Time 25°C to Peak
Temperature
6 minutes maximum 8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
T
smin
25° C to Peak
t
L
t
S
25
t
P
T
smax
T
L
T
P
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec