Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com C1003_C0G • 3/30/2016 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B 1 is for tape feeder reference only,
including draft concentric about B
o.
T 2
ØD 1
ØDo
B 1
S 1
T 1
E 1
E 2
P 1
P 2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metricwillgovern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
D
1
Minimum
Note 1
E
1
P
0
P
2
RReference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/-0.0
(0.059+0.004/-0.0)
1.0
(0.039)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P
1
T
2
Maximum
W
Maximum
A
0
,B
0
& K
0
8 mm Single(4mm)
4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
4.0±0.10
(0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm
Single(4mm)&
Double(8mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
8.0±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.157±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S
1
< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B
1
dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A
0
, B
0
and K
0
shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).
(e) for KPS Series product, A
0
and B
0
are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.