Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com C1002_X7R_SMD • 9/21/2015 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
TerminalStrength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnication50X.Conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°Ccategory3
c)MethodD,category3at260°C
Temperature Cycling JESD22MethodJA–104 1,000Cycles(-55°Cto+125°C).Measurementat24hours+/-4hoursaftertestconclusion.
Biased Humidity MIL–STD–202Method103
LoadHumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours+/-4hoursaftertestconclusion.
LowVoltHumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours+/-4hoursaftertestconclusion.
Moisture Resistance MIL–STD–202Method106
t=24hours/cycle.Steps7aand7bnotrequired.
Measurementat24hours+/-4hoursaftertestconclusion.
ThermalShock MIL–STD–202Method107
-55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20seconds.
Dwell time – 15 minutes. Air – Air.
HighTemperatureLife
MIL–STD–202Method108
/EIA–198
1,000hoursat125°Cwith2Xratedvoltageappliedexcludingthefollowing:
Case Size Capacitance Applied Voltage
0603 & 0805 ≥1.0µF
1.5 X
1206 & 1210 ≥10µF
Storage Life MIL–STD–202Method108 150°C,0VDCfor1,000hours.
Vibration MIL–STD–202Method204
5g'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick7secure
pointsononelongsideand2securepointsatcornersofoppositesides.Partsmountedwithin2"
from any secure point. Test from 10 – 2,000 Hz
MechanicalShock MIL–STD–202Method213 Figure1ofMethod213,ConditionF.
Resistance to Solvents MIL–STD–202Method215 Addaqueouswashchemical,OKEMCleanorequivalent.
Storage & Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustinother
environments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,andlongterm
storage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarpandtapepeelforcemay
increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximumstoragehumiditynotexceed70%
relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof
chlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstockshouldbeusedpromptly,preferablywithin1.5yearsof
receipt.