Datasheet

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 [phone] • www.kemet.com C1003_C0G • 10/5/2015 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G.
Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnication50X.Conditions:
a) Method B, 4 hours @ 155°C, dry heat @ 235°C
b) Method B @ 215°C category 3
c) Method D, category 3 @ 260°C
Temperature Cycling JESD22 Method JA–104 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 4 hours after test conclusion.
Biased Humidity MIL–STD–202 Method 103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement
at 24 hours +/- 4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/- 4 hours after test conclusion.
Moisture Resistance MIL–STD–202 Method 106
t = 24 hours/cycle. Steps 7a and 7b not required.
Measurement at 24 hours +/- 4 hours after test conclusion.
Thermal Shock MIL–STD–202 Method 107
-55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20 seconds, dwell
time – 15 minutes. Air – Air.
High Temperature Life
MIL–STD–202 Method 108
/EIA–198
1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours.
Vibration MIL–STD–202 Method 204
5g'sfor20min.,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick7secure
points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2"
from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F.
Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent.
Storage and Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%
relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationonthepartsandatmospheresshouldbefreeof
chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of
receipt.