User's Manual

Doc No: WG6611-00-DTS-D08

http://WWW.JORJIN.COM.TW

CONFIDENTIAL

Page 18

7. SMT AND BAKING RECOMMENDATION

7.1. Baking Recommendation

 Baking condition：

- Follow MSL Level 4 to do baking process.

- After bag is opened, devices that will be subjected to reflow solder or other high

temperature process must be

a) Mounted within 72 hours of factory conditions <30°C/60% RH, or

b) Stored at <10% RH.

- Devices require bake, before mounting, if Humidity Indicator Card reads >10%

If baking is required, Devices may be baked for 8 hrs at 125 °C.

7.2. SMT Recommendation

 Recommended Reflow profile：

No.

Item

Temperature (°C)

Time (sec)

Pre-heat

D1: 140 ~ D2: 200

T1: 80 ~ 120

Soldering

D2: = 220

T2: 60 ± 10

Peak-Temp.

D3: 250 °C max