System Board D2529 for TX300 S4 Technical Manual Edition November 2007
Comments… Suggestions… Corrections… The User Documentation Department would like to know your opinion of this manual. Your feedback helps us optimize our documentation to suit your individual needs. Feel free to send us your comments by e-mail to manuals@fujtsu-siemens.com.
Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Important notes . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.1 Notes on safety . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 CE Certificate . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.3 Environmental Protection . . . . . . . . . . . . . . . . . . . 11 3 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1 Overview . . . . . . . . . . . . . . . . . . . . .
1 Introduction This technical manual describes the system board D2529, which can be equipped with one or two Intel® processors. You will find further information in the BIOS description. Further information about drivers is provided in the readme files on the hard disk, on the supplied “ServerStart“ or “Update“ CDs.
2 Important notes In this chapter you will find essential information regarding safety when working with your server. V CAUTION! With the system board installed you must open the system to access the system board. How to access the system board of your system is described in the appropriate service supplement. When handling the system board, refer to the specific notes on safety in the operating manual and/or service supplement for the respective server. 2.
Notes on safety V Important notes ● Components can become very hot during operation. Ensure you do not touch components when making extensions to the system board. There is a danger of burns!. ● Transmission lines to peripheral devices must be adequately shielded. ● To the LAN wiring the requirements apply in accordance with the standards EN 50173 and EN 50174-1/2.
Important notes Notes on safety Modules with electrostatic-sensitive components Systems and components that might be damaged by electrostatic discharge (ESD) are marked with the following label: Figure 1: ESD label When you handle components fitted with ESDs, you must observe the following points under all circumstances: ● You must always discharge yourself of static charges (e.g. by touching a grounded object) before working. ● The equipment and tools you use must be free of static charges.
CE Certificate Important notes Notes about boards ● During installation/deinstallation of the system board, observe the specific instructions described in the service manual for the server. ● Remove the plug from the mains outlet so that system and system board are totally disconnected from the mains voltage. ● To prevent damage to the system board, the components and conductors on it, please take great care when you insert or remove boards.
Important notes 2.3 Environmental Protection Environmental Protection Environmentally friendly product design and development This product has been designed in accordance with standards for ”environmentally friendly product design and development“. This means that the designers have taken into account important criteria such as durability, selection of materials and coding, emissions, packaging, the ease with which the product can be dismantled and the extent to which it can be recycled.
Environmental Protection Important notes Returning, recycling and disposal The device may not be disposed of with household rubbish. This appliance is labelled in accordance with European Directive 2002/96/EC concerning used electrical and electronic appliances (waste electrical and electronic equipment - WEEE). The guideline determines the framework for the return and recycling of used appliances as applicable throughout the EU.
3 Features 3.1 Overview Processors – 1 or 2 dual or quad core Intel® Xeon™ processors – 2 processor sockets LGA771 for dual core Intel® Xeon™ processors – 1x6, 2x6, 2x4 or 4 MB Second-Level-Cache (on-die unified, 64 byte cacheline size) – 32 KB L1 Cache (on-die, data per core) – 32 KB L1 Cache (on-die, instruction per core) – 2 x 266 MHz or 333 MHz data bus (equals FSB 1066 or 1333: quadruple data rate (or quad pumping) delivers 4 bits of data per clock cycle) – 2 VRM 11.
Overview Features – ADM7462 thermal system management controller Internal connectors – – – – – – – – – – – – – – – – 1 floppy disk connector (26 pin) 1 USB connector 3 Serial ATA Power connector 24 pin (12V, -12V, 5V, 3.3V and 5V auxiliary) Dual 12V power connector Single 12V power connector PC98 connector Front panel dual USB type C (for USB 2.
Features Overview BIOS features – – – – – – – – Phoenix System-BIOS V 4.06 SMBIOS 2.4 (DMI) MultiProcessor Specification 1.4 Server Hardware Design Guide WfM ACPI support USB keyboard/mouse boot possible from: – – – – – floppy disk drive (USB, Standard) – hard disk (SATA, SAS) – CD/DVD (SATA) – LAN (PXE, iSCSI) console redirection support OEM logo CPU, memory disable spare memory support Environmental protection 3V-Battery in holder for recycling Form factor – 290 x 460 mm – ACPI 2.0, OnNow, PCI-X 1.
Overview Features The TPM is activated via the BIOS system (for more information, refer to the Fujitsu Siemens Computers BIOS manual). V CAUTION! – When using the TPM, note the program descriptions provided by the third party manufacturers. – You must also create a backup of the TPM content. To do this, follow the third party manufacturer's instructions. Without this backup, if the TPM or the system board is faulty you will not be able to access your data.
Features 3.2 Main memory Main memory The system board supports up to 64 Gbyte main memory. Two slots for riser cards with 8 FBD slots each are available . Each memory bank can be populated with two 512 Mbyte, 1 Gbyte, 2 Gbyte or 4 Gbyte FBD PC2-4200F or FDB PC2-5300F fully buffered DIMM memory modules. ECC with memory scrubbing and with the Single Device Data Correction (SDDC) function is supported. I You will find the descriptions how to install memory modules in the Options Guide of your server.
Main memory Features Module population DIMM 4D DIMM 4C DIMM 3D DIMM 3C DIMM 2D DIMM 2C DIMM 1D DIMM 1C DIMM 4B DIMM 4A DIMM 3B DIMM 3A DIMM 2B DIMM 2A DIMM 1B DIMM 1A DIMM C/D DIMM A/B Figure 3: Layout of the memory modules – The memory banks have to be populated sequentially top down in pairs of FBD PC2-4200F oder FBD PC2-5300 Fully Buffered DIMM memory modules. – Each pair consists of identical memory modules.
Features Main memory Non-mirrored mode Using one riser card the module population is as follows: 1A + 1B (minimum configuration) - 2A + 2B - 3A + 3B - 4A + 4B Using two riser cards the population can be alternating (higher performance) or consecutive.
PCI(e) slots Features Sparing mode Only one riser card is required for the sparing mode. The last populated bank will be in hotspare mode. 1A + 1B, 2A +2B minimum configuration, bank 2 in hotspare mode 1A + 1B, 2A +2B, 3A +3B upgrade 1, bank 3 in hotspare mode 1A + 1B, 2A +2B, 3A +3B, 4A + 4B upgrade 2, bank 4 in hotspare mode 3.
Features PCI(e) slots PCI slots The following table shows an overview of the PCI slots: PCI slot Bit Frequency Description in MHz 1 PCI e x4 slot 2 PCI e x4 slot 3 PCI e x4/x8 slot 4 64 Bit 133 64-Bit PCI-X slot 5 PCI e x4 slot 6 PCI e x4/x8 slot 7 PCI e x4 slot Slot 3 and slot 6 are automatically used as x8 slots, if slot 2 respectivly slot 5 are not occupied.
PCI(e) slots Features The following interrupt signals are used in the system: Slot/device Property Interruptsignal VGA iRMC Grafik Int A LAN 1 BCM5708 Int B LAN 2 BCM5708 Int C Steckplatz 7 PCI e x4 Int A, B, C, D Steckplatz 6 PCIe x8 Int A, B, C, D Steckplatz 5 PCIe x4 Int A, B, C, D Steckplatz 4 PCI (133 MHz) Int A, B, C, D Steckplatz 3 PCIe x8 Int A, B, C, D Steckplatz 2 PCIe x4 Int B, C, D, A Steckplatz 1 PCIe x4 Int A, B, C, D Assignment of the PCI interrupts If you se
Features 3.4 Screen resolution Screen resolution Depending on the operating system used the screen resolutions in the following table refer to the graphic controller on the system board. The graphic controller is integrated in the iRMC (integrated Remote Management Controller). Screen resolution Max. color depth Max.
Temperature / system monitoring Features Fan speed control The fan speed is controlled according to temperature. The criteria are the ambient temperature, the CPU temperature, and the memory temperature. Sensor monitoring If the I2C temperature sensor is defect or missing, all fans monitored by this sensor, run with maximum speed to achieve the greatest possible protection of the hardware.
Features 3.
LEDs Features DIMM 4D DIMM 4C DIMM 3D DIMM 3C DIMM 2D DIMM 2C DIMM 1D DIMM 1C DIMM 4B DIMM 4A DIMM 3B DIMM 3A DIMM 2B DIMM 2A DIMM 1B DIMM 1A L Figure 6: LEDs on the riser card LED s A, B and C are visible from outside on the rear of the server. All the other LEDs are only visible, if the cover of the server has been opened. If the server has been powered off (power-plugs must be disconnected) it is possible to indicate the faulty component by pressing the indicate CSS button.
Features LEDs LED Anzeige Bedeutung D - PCI card off PCI card ok orange PCUI card failure orange CPU error (Local Diagnostic LED) off CPU ok green fan ok orange fan error (Local Diagnostic LED) green flashing iRMC - Server Management Controller ok off iRMC not active H - Board Error red configuration error. The system board will be held in reset. Possible configuration errors are e.g.: old CPU populated, CPUs with different FSB requirements populated, CPU1 not populated.
Interfaces and connectors 3.
Features Interfaces and connectors 1 = PCI slots 12 = SATA4 2 = external ports 13 = SATA2 3 = slots for main memory modules 14 = CPU 1/2 fan 4 = Power supply PWR2 15 = Intrusion 5 = Power supply PWR3 16 = USB 2 AUX 6 = PC98 17 = USB 1 AUX 7 = Power supply PWR1 18 = CSS push-button 8 = Front panel 19 = USB intern 9 = USB front 20 = DIP-Schalter (siehe page 32) 10 = Floppy disk drive 21 = HD LED 11 = SATA1 22 = LPC bus (for assembly only) D2529 (TX300 S4) Technical Manual 29
Interfaces and connectors 3.7.
Features Interfaces and connectors LAN connectors The system board is populated with three LAN controllers. – 2 Gigabit LAN controllers (BCM5708) for system LAN 1 and system LAN 2 System LAN 1 and system LAN 2 support: – transfer rates of 10 Mbit/s, 100 Mbit/s and 1 Gbit/s – WOL function through Magic Packet™ – Intel PXE. It is possible to boot tehe system without its own boot hard disk via LAN. In addition system LAN 1 can be used as shared service LAN.
Settings with DIP switches Features LED 2 LED 1 Figure 10: LAN connector service LAN controller LAN 1 LAN transfer green rate green off transfer rate 10 Mbit/s on transfer rate 100 Mbit/s LAN 2 LAN link/activity on LAN connection off no LAN connection flashing LAN transfer 3.8 green Settings with DIP switches Figure 11: DIP switch I Preset for switches 1 to 4 = Off.
Features Settings with DIP switches Skipping the password query - switch 2 Switch 2 is used to define whether the password is queried at system startup, if the password protection is enabled in BIOS Setup (in Security menu, the Password field must be set to Enabled). on The password query is skipped. Passwords are deleted. off The password query is effective (default setting). Write protection for Flash BIOS - switch 3 Switch 3 is used to define whether the System BIOS is write protected or not.
Settings with DIP switches 34 Features Technical Manual D2529 (TX300 S4)
4 Replacing the lithium battery In order to save the system information permanently, a lithium battery is installed to provide the CMOS-memory with a current. When the charge is too low or the battery is empty, a corresponding error message is provided. The lithium battery must then be replaced. V CAUTION! The lithium battery must be replaced with an identical battery or a battery type recommended by the manufacturer (CR2450). Do not throw lithium batteries into the trash can.
Abbreviations The technical terms and abbreviations given below represent only a selection of the full list of common technical terms and abbreviations. Not all technical terms and abbreviations listed here are valid for the described system board.
Abbreviations DIP Dual In-line Package DMI Desktop Management Interface DRAM Dynamic Random Access Memory ECC Error Correction Code EEPROM Electrical Erasable Programmable Read Only Memory EPROM Erasable Programmable Read Only Memory EMRL Embedded RAID Logic EVRD Enterprise VRD FBD Fully Buffered DIMM HPC Hot-plug Controller ICE In Circuit Emulation IDE Integrated (intelligent) Drive Electronics IME Integrated Mirror Enhanced IOOP Intelligent Organization Of PCI 38 Technical Manual D2529 (TX300 S4)
Abbreviations IPMB Intelligent Platform Management Bus IPMI Intelligent Platform Management Interface iRMC integrated Remote Management Controller iSCSI internet Small Computer System Interface LAN Local Area Network LED Light Emitting Diode LPC Low Pin Count MPS Multi Processor Specification MTS MegaTransfers per Second NMI Non Maskable Interrupt OEM Original Equipment Manufacturer OHCI Open Host Controller Interface OS Operating System PCI Peripheral Components Interconnect D2529 (TX300 S4) Technical Ma
Abbreviations PDA Prefailure Detection and Analyzing PIO Programmed Input Output PLD Programmable Logic Device PS(U) Power Supply (Unit) PWM Puls Wide Modulation PXE Preboot eXecution Environment RAID Redundant Array of Inexpensive Disks RSB Remote Service Board RST ReSeT RTC Real Time Clock SAS Serial Attached SCSI SATA Serial ATA SCSI Small Computer Systems Interface SDDC Single Device Data Correction 40 Technical Manual D2529 (TX300 S4)
Abbreviations SDRAM Synchronous Dynamic Random Access Memory SHDG Server Hardware Design Guide SMB System Management Bus SMM Server Management Mode SMP Symmetrically Multi Processing TMP Trusted Platform Module UHCI Unified Host Controller Interface USB Universal Serial Bus VGA Video Graphics Adapter VRD Voltage Regulator Down VRM Voltage Regulator Module WfM Wired for Management WOL Wake up On LAN D2529 (TX300 S4) Technical Manual 41
