Datasheet

AD5541A
Rev. A | Page 20 of 20
2.44
2.34
2.24
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
01-24-2011-B
Figure 38. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
INL DNL
Power-On
Reset to Code Temperature Range Package Description
Package
Option
Branding
Code
AD5541ABRMZ ±1 LSB ±1 LSB Zero Scale −40°C to +125°C 10-Lead MSOP RM-10 DEQ
AD5541ABRMZ-REEL7 ±1 LSB ±1 LSB Zero Scale −40°C to +125°C 10-Lead MSOP RM-10 DEQ
AD5541AARMZ ±2 LSB ±1 LSB Zero Scale −40°C to +125°C 10-Lead MSOP RM-10
DER
AD5541AARMZ-REEL7 ±2 LSB ±1 LSB Zero Scale −40°C to +125°C 10-Lead MSOP RM-10
DER
AD5541AACPZ-REEL7 ±2 LSB ±1 LSB Zero Scale −40°C to +125°C 10-lead LFCSP_WD CP-10-9
DER
AD5541ABCPZ-REEL7 ±1 LSB ±1 LSB Zero Scale −40°C to +125°C 10-lead LFCSP_WD CP-10-9
DEQ
AD5541ABCPZ-500RL7 ±1 LSB ±1 LSB Zero Scale −40°C to +125°C 10-lead LFCSP_WD CP-10-9
DEQ
AD5541ABCPZ-1-RL7 ±1 LSB ±1 LSB Zero Scale −40°C to +125°C 8-lead LFCSP_WD CP-8-11
DFG
EVAL-AD5541ASDZ AD5541A Evaluation Board
1
Z = RoHS Compliant Part.
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D08516-0-3/11(A)