Datasheet

DATE REVISION APPROVAL BY
DIMENSION
DRAW BY
APPROVAL BY
DATE
mm
Vivian Lai
Rikki
26-08-2014
1
2
3
4
5
6
A
B C D E F G H
PART No
NAME
SMD package to DIP Converter Board
SOP14-SSOP14
17.8
17.8
1.27mm
1
2
3
side 1
side 2
2.54
Function:
SOP14 & SSOP14 package to DIP
Technical Data:
Board Material FR-4
SOP14 (side 1)
SSOP14 (side 2)
1.27 (Side 1)
0.65 (Side 2)
Board Thickness 1.6mm ± 0.1mm
Surface Technioque Spray tin 5-8um
Copper Thickness 35um ± 5um
Solderability 260°C at 3s - 1.1%
Flammability V-0
Surface Resistivity 1.0 x 106 MΩ
Volume Resistivity 1.0 x 108 MΩ - cm
Arc Resistance 125sec.
Pitch
SMD package
4
7
5
6
SOP14
14
13
12
11
8
10
9
0.65mm
1
2
3
4
7
5
6
SSOP14
14
13
12
11
8
10
9
mm ±0.2