Datasheet
4
HCPL-817-300E
Absolute Maximum Ratings (T
A
= 25°C)
Storage Temperature, T
S
–55°C to +125°C
Operating Temperature, T
A
–30°C to +100°C
Lead Solder Temperature, max.
(1.6 mm below seating plane)
260°C for 10 s
Average Forward Current, I
F
50 mA
Reverse Input Voltage, V
R
6 V
Input Power Dissipation, P
I
70 mW
Collector Current, I
C
50 mA
Collector-Emitter Voltage, V
CEO
70 V
Emitter-Collector Voltage, V
ECO
6 V
Collector Power Dissipation 150 mW
Total Power Dissipation 200 mW
Isolation Voltage, V
iso
(AC for 1 minute, R.H. = 40 ~ 60%) 5000 Vrms
Note: Non-halide flux should be used.
1. One-time soldering reflow is recommended within the
condition of temperature and time profile shown.
2. When using another soldering method such as infrared
ray lamp, the temperature may rise partially in the mold
of thedevice. Keep the temperature on the package of
the device within the condition of (1) above.
6.5 ± 0.5
(0.256)
Dimensions in Millimeters and (Inches)
4.6 ± 0.5
(0.181)
2.54 ± 0.25
(0.1)
3.5 ± 0.5
(0.138)
7.62 ± 0.3
(0.3)
0.26
(0.010)
10.16 ± 0.3
(0.4)
1.2 ± 0.1
(0.047)
0.35 ± 0.25
(0.014)
1.0 ± 0.25
(0.039)
A 817
YWW
DATE CODE
RANK
LEAD FREE
ANODE
Solder Reflow Temperature Profile
30 seconds
60 ~ 150 sec 90 sec 60 sec
60 sec
25°C
150°C
200°C
250°C
260°C (Peak Temperature)
217°C
Time (sec)
Temperature (°C)