Datasheet

ADV212
Rev. B | Page 41 of 44
OUTLINE DIMENSIONS
*COMPLIANT WITH JEDEC STANDARDS MO-192-ABD-1 WITH
EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.
DETAIL A
0.70
0.60
0.50
BALL DIAMETER
0.20
COPLANARITY
1.00
BSC
10.00
BSC SQ
A
B
C
D
E
F
G
H
J
K
L
10
8
7
6
3
2
1
9
5
4
11
*
1.31
1.21
1.11
A1 CORNER
INDEX AREA
TOP VIEW
BALL A1
CORNER
DETAIL A
BOTTOM VIEW
0.50 NOM
0.30 MIN
*
1.85
1.71
1.40
12.20
12.00 SQ
11.80
082406-A
SEATING
PLANE
Figure 40. 121-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-121-1)
Dimensions shown in millimeters
SEATING
PLANE
DETAIL A
0.70
0.60
0.50
BALL DIAMETER
COPLANARITY
0.20 MAX
1.00 BSC
11.00
BCS SQ
A
B
C
D
E
F
G
J
H
K
L
M
12
11
10 8
7
6
3
2
1
9
5
4
0.53
0.43
A1 CORNER
INDEX AREA
TOP VIEW
13 .00
BSC SQ
BALL A1
INDICATOR
DETAIL A
BOTTOM VIEW
*
1.85
MAX
*
1.32
1.21
1.11
*
COMPLIANT WITH JEDEC STANDARDS MO-192-AAD-1 WITH
EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.
021506-A
Figure 41. 144-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-144-3)
Dimensions shown in millimeters