Datasheet

ADuC7128/ADuC7129
Rev. 0 | Page 91 of 92
OUTLINE DIMENSIONS
*
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
EXCEPT FOR EXPOSED PAD DIMENSION
063006-B
PIN 1
INDICATOR
TOP
VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
17
49
48
32
33
0.50
0.40
0.30
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60 MAX
*
4.85
4.70 SQ
4.55
EXPOSED PAD
(BOTTOM VIEW)
0.30
0.25
0.18
SEATING
PLANE
PIN 1
INDICATOR
THE EXPOSE PAD IS NOT CONNECTED
INTERNALLY. FOR INCREASED RELIABILITY
OF THE SOLDER JOINTS AND MAXIMUM
THERMAL CAPABILITY IT IS RECOMMENDED
THAT THE PAD BE SOLDERED TO
THE GROUND PLANE.
16
Figure 73. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
051706-A
TOP VIEW
(PINS DOWN)
1
16
17
33
32
48
4964
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
12.20
12.00 SQ
11. 80
PIN 1
1.60
MAX
0.75
0.60
0.45
10.20
10.00 SQ
9.80
VIEW A
0.20
0.09
1.45
1.40
1.35
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
0.15
0.05
7°
3.5°
0°
Figure 74. 64-Lead Low Profile Quad Flat Package [LQFP]
(ST-64-2)
Dimensions shown in millimeters