Datasheet

Data Sheet ADF4360-3
Rev. D | Page 23 of 24
OUTLINE DIMENSIONS
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-2
04-09-2012-A
1
0.50
BSC
PIN 1
INDICATOR
2.50 REF
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
2.45
2.30 SQ
2.15
24
7
19
12
13
18
6
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
Figure 24. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Frequency Range Package Description Package Option
ADF4360-3BCPZ −40°C to +85°C 1600 MHz to 1950 MHz 24-Lead LFCSP_VQ CP-24-2
ADF4360-3BCPZRL −40°C to +85°C 1600 MHz to 1950 MHz 24-Lead LFCSP_VQ CP-24-2
ADF4360-3BCPZRL7 −40°C to +85°C 1600 MHz to 1950 MHz 24-Lead LFCSP_VQ CP-24-2
EV-ADF4360-3EB1Z Evaluation Board
1
Z = RoHS Compliant Part.