Datasheet

Data Sheet ADF4154
Rev. C | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter
1, 2, 3
Rating
V
DD
to GND −0.3 V to +4 V
V
DD
to V
DD
−0.3 V to +0.3 V
V
P
to GND −0.3 V to +5.8 V
V
P
to V
DD
−0.3 V to +5.8 V
Digital I/O Voltage to GND −0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to GND −0.3 V to V
DD
+ 0.3 V
REF
IN
, RF
IN
to GND
−0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
TSSOP θ
JA
Thermal Impedance 112°C/W
LFCSP θ
JA
Thermal Impedance
(Paddle Soldered)
30.4°C/W
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 40 sec
1
This device is a high performance RF-integrated circuit with an ESD rating of
<2 kV, and it is ESD sensitive. Proper precautions should be taken when
handling and assembling the device.
2
GND = A
GND
= D
GND
= 0 V.
3
V
DD
= AV
DD
= DV
DD
= SDV
DD
.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION