Datasheet

AD8638/AD8639
Rev. F | Page 17 of 20
COMPLIANT TO JEDEC STANDARDS MO-187-AA
100709-B
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 57. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
112008-A
PIN 1
INDICATOR
(R 0.2)
EXPOSED
PAD
BOTTOM VIEW
TOP VIEW
1
4
8
5
INDEX
AREA
3.00
BSC SQ
SEATING
PLANE
0.80
0.75
0.70
0.30
0.25
0.18
0.05 MAX
0.02 NOM
0.80 MAX
0.55 NOM
0.20 REF
0.50 BSC
COPLANARITY
0.08
2.48
2.38
2.23
1.74
1.64
1.49
0.50
0.40
0.30
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION
SECTIONOFTHISDATASHEET.
Figure 58. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-5)
Dimensions shown in millimeters