Datasheet

Data Sheet AD8475
Rev. C | Page 23 of 24
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
0.30
0.25
0.20
1.65
1.50 SQ
1.45
1
0.50
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
0.50
0.40
0.30
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.80
0.75
0.70
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
01-26-2012-A
Figure 57. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-27)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-BA
091709-A
6°
0°
0.70
0.55
0.40
5
10
1
6
0.50 BSC
0.30
0.15
1.10 MAX
3.10
3.00
2.90
COPLANARITY
0.10
0.23
0.13
3.10
3.00
2.90
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 58. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters