Datasheet

Data Sheet AD8376
Rev. B | Page 23 of 24
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
PIN 1
INDICATOR
32
916
17
24
25
8
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.25
3.10 SQ
2.95
S
EATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.25
0.18
5.10
5.00 SQ
4.90
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.50
0.40
0.30
0.25 MIN
Figure 52. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8376ACPZ-WP −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ] , Waffle Pack CP-32-7
AD8376ACPZ-R7 −40°C to +85°C 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ], 7” Tape and Reel CP-32-7
AD8376-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.