Datasheet

AD8375 Data Sheet
Rev. A | Page 6 of 24
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
1VCOM
2VIN+
3VIN–
4A4
5A3
6A2
15 VOUT+
16 VOUT–
17 VOUT+
18 VOUT–
14 COMM
13 VPOS
7
A1
8
A0
9
V
POS
11
COMM
12
VPOS
10
VPOS
21
COMM
22
COMM
23
VPOS
24
COMM
20
COMM
19
PWU
P
06724-002
AD8375
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED PAD IS INTERNALLY CONNECTED TO GROUND.
SOLDER TO A LOW IMPEDANCE GROUND PLANE.
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 VCOM Common-Mode Pin. Typically bypassed to ground using external capacitor.
2 VIN+ Voltage Input Positive.
3 VIN− Voltage Input Negative.
4 A4 MSB for the 5-Bit Gain Control Interface.
5 A3 MSB − 1 for the Gain Control Interface.
6 A2 MSB − 2 for the Gain Control Interface.
7 A1 LSB + 1 for the Gain Control Interface.
8 A0 LSB for the 5-Bit Gain Control Interface.
9, 10, 12, 13, 23 VPOS Positive Supply Pins. Should be bypassed to ground using suitable bypass capacitor.
11, 14, 20, 21, 22, 24 COMM Device Common (DC Ground).
15, 17 VOUT+ Positive Output Pins (Open Collector). Require dc bias of +5 V nominal.
16, 18 VOUT− Negative Output Pins (Open Collector). Require dc bias of +5 V nominal.
19 PWUP Chip Enable Pin. Enabled with a logic high and disabled with a logic low.
EPAD
Exposed Pad. The Exposed Pad is internally connected to ground. Solder to a low impedance
ground plane.