Datasheet

AD8270
Rev. 0 | Page 19 of 20
OUTLINE DIMENSIONS
16
5
13
8
9
12
1
4
1.95 BSC
PIN 1
INDICATOR
TOP
VIEW
4.00
BSC SQ
3.75
BSC SQ
COPLANARITY
0.08
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.35
0.30
0.25
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
0.65 BSC
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
0.50
0.40
0.30
0.25 MIN
2.50
2.35 SQ
2.20
010606-0
Figure 52. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-16-10)
Dimensions are shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD8270ACPZ-R7
1
−40°C to +85°C 16-Lead LFCSP_VQ CP-16-10
AD8270ACPZ-RL
1
−40°C to +85°C 16-Lead LFCSP_VQ CP-16-10
AD8270ACPZ-WP
1
−40°C to +85°C 16-Lead LFCSP_VQ CP-16-10
1
Z = RoHS Compliant Part.