BL-M8822CU3 Module Specification
Module Name: BL-M8822CU3 Module Type: 802.11a/b/g/n/ac 2T2R WiFi Module Revision: V1.
Revision History Revision Summary Release Date 0.1 Initial release 2020-06-19 1.0 Final release 2020-07-29 1. Introduction BL-M8822CU3 is a highly integrated module that was built in a 2*2 dual-band wireless LAN radio. It combines a WLAN MAC, a 2T2R capable WLAN base band, and RF in a single chip. It supports IEEE 802.11a/b/g/n/ac standard and provides the highest PHY rate up to 867Mbps, offering feature-rich wireless connectivity and reliable throughput from an extended distance. 1.
1.2 Block Diagram 1.3 General Specifications Module Name BL-M8822CU3 Chipset RTL8822CU-CG WiFi Standards IEEE802.11a/b/g/n/ac, 2T2R MIMO, 2.4G/5GHz, 866.7Mbps (Max) Host Interface USB2.0 for WiFi Antenna Connect to external antenna through Half hole pads Dimension SMD 32Pins, 27*18*2.0mm (L*W*H), Tolerance: +/-0.15mm Power Supply DC 3.3V±0.
2. Pin Assignments 2.1 Pin Definition No Pin Name 1 NC / NC 2 NC / NC 3 NC / NC 4 NC / NC 5 GND p Ground 6 USB_DP I/O USB data+ (USB2.0) 7 USB_DM I/O USB data- (USB2.
10 SUS_CLK I External 32K or RIC clock input 11 GND - Ground 12 RF I/O RF port 13 GND / Ground 14 WAKE_HOST O wake up HOST 15 HOST_WAKE I Host wakes up 16 EESK I WLAN efuse autoload 17 GPIO4 18 GND 19 WL-RF1 20 GND p Ground 21 GND p Ground 22 WL-RF0 23 GND p Ground 24 GND p Ground 25 GND p Ground WL-WAKE-HOST O WL functions to wake up the host when the remote wake function is enabled 27 HOST-WAKE-WL I Host wakes up the WLAN controller in Remote W
3.2 Digital I/O DC Specifications Symbol Parameter Min Typ Max Units VIH Input High Voltage 2.0 3.3 3.6 V VIL Input Low Voltage -- 0 0.9 V VOH Output High Voltage 2.97 -- 3.3 V VOL Output Low Voltage 0 -- 0.33 V 3.3 Current Consumption Conditions : VDD33=3.3V ; Ta:25℃ Use Case VBAT Current (average) Typ Max Units WiFi Unassociated (Linux Driver) 2g 278 890 mA WiFi Unassociated (Linux Driver) 5g 322 940 mA 2.4G 1Mbps TX (RF-Test) 17 466 550 mA 2.
2.4G MCS0(HT40) RX (RF-Test) 226 268 mA 2.4G MCS7(HT40) TX (RF-Test)14 253 456 mA 2.4G MCS7(HT40) RX (RF-Test) 232 268 mA 2.4G MCS8(HT40) TX (RF-Test)14 399 740 mA 2.4G MCS8(HT40) RX (RF-Test) 226 268 mA 2.4G MCS15(HT40) TX (RF-Test)14 278 752 mA 2.
5G MCS9(VHT40) TX (RF-Test)12 243 512 mA 5G MCS9(VHT40) RX (RF-Test) 230 416 mA 5G MCS0(VHT80) TX (RF-Test)13 332 584 mA 5G MCS0(VHT80) RX (RF-Test) 238 556 mA 5G MCS9(VHT80) TX (RF-Test)11 248 564 mA 5G MCS9(VHT80) RX (RF-Test) 245 556 mA 4. Interface Timing Specifications 4.1 USB Bus during power on Sequence Typical Timing Range Unit Min. Typ. Max. Ton ms - 1.5 5 Ten ms 0 0 5 Tgate ms 0 1.5 8 Tattch ms 100 250 - Txtal ms - 1.
5. WiFi RF Specifications 5.1 2.4G WiFi RF Specification Conditions: VDD33=3.3V; Ta:25℃ Features Description WLAN Standard IEEE 802.11b/g/n CSMA/CA Frequency Range 2.412~2.462GHz (2.4GHz ISM Band) 802.11b DSSS: CCK, DQPSK, DBPSK Modulation 802.11g OFDM: 64QAM,16QAM, QPSK, BPSK 802.11n OFDM: 64QAM,16QAM, QPSK, BPSK 802.11b: 1, 2 ,5.5,11Mbps, Date Rate 802.11g: 6,9,12,18,24,36,48,54Mbps, 802.11n-2.4 HT20: MCS0~MCS7, 802.11n-2.4 HT40: MCS0~MCS7 Frequency Tolerance ≦ ±25ppm 2.
5.2 5G WiFi RF Specification Conditions: VDD33=3.3V; Ta:25℃ Features Description WLAN Standard IEEE 802.11a/n/ac CSMA/CA Frequency Range 5.15~5.25GHz; 5.725~5.85GHz (5GHz ISM Band) Ch36~Ch48; Ch149~Ch165 (For 20MHz Channels) Channels Ch38~Ch46; Ch151~Ch159 (For 40MHz Channels) Ch42; Ch155 (For 80MHz Channels) 802.11a (OFDM): BPSK, QPSK, 16QAM, 64QAM; Modulation 802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11ac (OFDM): BPSK, QPSK, 16QAM, 64QAM, 256QAM; 802.
802.11n@HT40_MCS0 8dBm ±2.0dBm ≦-10dB 8dBm ±2.0dBm ≦-28dB 802.11ac@VHT80_MCS0 7dBm ±2.0dBm ≦-10dB 802.11ac@VHT80_MCS9 7dBm ±2.0dBm ≦-32dB RX Rate Min Input Level(Typ) Max Input Level(Typ) PER 802.11a@6Mbps -88dBm -20dBm < 10% 802.11a@54Mbps -74dBm -20dBm < 10% 802.11n@HT20_MCS0 -86dBm -20dBm < 10% 802.11n@HT20_MCS7 -70dBm -20dBm < 10% 802.11n@HT40_MCS0 -84dBm -20dBm < 10% 802.11n@HT40_MCS7 -68dBm -20dBm < 10% 802.11ac@VHT20_MCS8 -66dBm -20dBm < 10% 802.
6. Mechanical Specifications 6.1 Module Outline Drawing Module dimension: 27.0mm*18.0mm*2.0mm (L*W*H; Tolerance: ±0.15mm) Module Bow and Twist: ≤0.
6.2 Mechanical Dimensions Top View 7. Application Information 7.
7.2 Recommend PCB Layout Footprint 7.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃.
8. Key Components Of Module No. Parts 1 Chipset 2 PCB Specification RTL8822CU-CG, QFN-56pin-7*7mm Manufacturer Realtek BL-M8822CU3, MILLION SOURCE PRINTED CIRCUIT BOARD CO., LTD 27*18*0.6mm, Shen Zhen Tie Fa Technology Limited 4L, AU, Green Quzhou Sunlord Electronics Co., Ltd LUCKI CM ELECTRONICS CO., LTD 3 Crystal 40MHz-9pF-10ppm-3225 HUBEI TKD ELECTRONICS TECHNOLOGY CO., LTD HOSONIC ELECTRONIC CO., LTD TDK China Co., Ltd 4 Diplexer DP1608-A2455BKH0T-LF Advanced Ceramic X 9.
Package specification: 1. 1,000 modules per roll and 4,000 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 4 boxes. 9.
10. Antenna Information 0.
FCC Statement: Please take attention that changes or modification not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation.
(6) FCC other Parts, Part 15B Compliance Requirements for Host product manufacturer This modular transmitter is only FCC authorized for the specific rule parts listed on our grant, host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. Host manufacturer in any case shall ensure host product which is installed and operating with the module is in compliant with Part 15B requirements.
