-0- Zigbee Module Data Sheet REX3P V3.0.
-1- Copyright The information contained in this document is the proprietary information of Zhejiang Rexense Technology Co., Ltd. (hereinafter referred to as Rexense or the company). All rights reserved. Without the written permission of the company, the content of the document shall not be disclosed to the company's employees, agents, partners or any unauthorized parties in any form without authorization, copying or dissemination of this document is prohibited.
-2- Document Change List V1.0.0 Initial version V3.0.0 2019/1/30 Hardware Version Added Content 1. Production Introduction..................................................................................................................................- 3 1.1 Introduction..............................................................................................................................................- 3 1.2 Application..........................................................................
-31.4 Product Advantage................................................................................................................................ - 4 1.5 Abbreviations...........................................................................................................................................- 5 1.6 Related documents................................................................................................................................ - 6 2. Product Overview.......................
-4and ZigBee3.0 protocol standard. It has been widely used in fields of wireless sensing, control and data collection. The application of this module saves users much time and energy in the development. 1.2 Application REX3B module conforms to IEEE 802.15.4 specification and ZigBee3.0, supports the mesh network which is self-healing and self-assembling, optimizes the network rate and power consumption. This module supports the setting and configuration as below: Standard ZigBee 3.
-5 Max receiving sensitivity：-101dBm Max link budget：120dBm Reliable communication distance：1000m（view distance） Extreme low power consumption Sleep mode：<2.8µA Receiving mode：12mA Transmitting mode：127mA@19.
-6DC Direct Current DTR Data Terminal Ready DIP Dual In-line package EEPROM Electrically Erasable Programmable Read-Only Memory ESD Electrostatic Discharge GPIO General Purpose Input/Output HAL Hardware Abstraction Layer HVAC Heating, Ventilating and Air Conditioning HW Hardware TWI Inter-Integrated Circuit IEEE Institute of Electrical and Electronics Engineers IRQ Interrupt Request ISM Industrial, Scientific and Medical radio band JTAG Digital interface for debugging of embedded
-7- 1.6 Related documents [1] ZigBee 3.0 – The Open, Global Standard for the Internet of Things December 2, 2014 2. Product Overview 2.1 Overview REX3P is a ZigBee module of compact layout, higher sensitivity and lower power, and conforms to IEEE 802.15.4 and ZigBee 3.0 standard protocol. Based on Rexense’s innovative RexBee hardware platform, this module has outstanding RF characteristics, lower power consumption, powerful. Table 2-1 Product diagram XTAL (Crystal Frequency 38.
-8different environments. At the same time, our company also provides a complete set of development and evaluation kits, users can choose kits of different versions for testing and development according to their requirements. 3. Technical Specification 3.1. Electrical Specification 3.1.1. Electrical Specification Table 3-1. Absolute Maximum Ratings Parameter Min 最Max （VCC）Module input voltage（VCC） 1.85V 3.8V Pin voltage (except ADC pin) -0.3V VDD_PADS+0.3 ADC Pin voltage -0.3V 2.
-9- 3.1.3. RF Electrical Characteristics Table 3-3. RF Electrical Characteristics Parameter Test condition Range Unit Frequency range 2400~2483.5 Channels 16 Signal No. 0B~1A Hex Channel spacing 5 MHz Transmitting power -9 to +19 dBm -100 dBm 250 kbps 50 Ω Receiving sensitivity Packet loss≤1% Max transmitting rate Rated Input / Output Impedance For unbalanced output MHz 3.1.4. Processor Characteristics Table 3-4.
- 10 VCC Real-time clock frequency 32.768 3.2. Physical/Ambient Characteristics Table 3-6. Physical/Ambient Characteristics Parameter Physical size Weight *Working temperature Relative working Humidity 3.3. Pin Configuration Figure3-1.Layout Dimension Value 18.0*15.0*2.
- 11 Figure3-2.
- 12 Table 3-9. Pin Configuration Table 3-10. Pin Description No. of module pins No. of QFN48 Pin package signal Direction Pin specification pins 1 14，15，37 GND - Ground 2 4 PF3 I/O 3 3 PF2 I/O 4 6 PF5 I/O Digital I/O 5 5 PF4 I/O Digital I/O.
- 13 No. of module pins No.
- 16 - 3.4. Test Result of RF Performance Figure3-17. Table 3-17 Receiving Sensitivity Figure 3-18.
- 17 Figure 3-19. Test of Modulation Signal 3.6. Soldering Temperature for Module The max temperature for soldering module shall be within 237-245℃ in 20s.
- 18 - 3.5.
- 19 - 4. Ordering Information Manufacturer REX=REXENSE Series 3=Zigbee Packaging Type M=MINI zigbeemodule B = Module for Smart Light(default) P =EFR32 Ultra-small Module(default) Chip Model 011= EFR32MG1B232F256 012= EFR32MG1B232F256(default) 136= EFR32MG13P632F512 137= EFR32MG13P732F512 Antenna L=L, No IPEX connector U=U.
- 20 - 5. Contact Us Zhejiang Raying IoT Technology Co., Ltd. Add：10F,North of Building No.10,Wellong Science & Technology Park, No.88 Jiangling Road, Binjiang District,Hangzhou,310051 China Tel：+86-571-85395623 Fax：+86-571-87987620 Email: intl@rexense.com Web：www.rexense.com Antenna Manufacturer: Shenzhen boantong technology co. LTD 深圳市博安通科技股份有限公司 Model: An2400p Gain: 1.
FCC Statement FCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247 Exrernal antenna with antenna gain 1.5dBi This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
