Data Sheet of ZigBee Module REX3B21 V5.
1 Copyright The information contained in this document is the proprietary information of Zhejiang Rexense Technology Co., Ltd. (hereinafter referred to as Rexense or the company). All rights reserved. Without the written permission of the company, the content of the document shall not be disclosed to the company's employees, agents, partners or any unauthorized parties in any form without authorization, copying or dissemination of this document is prohibited.
2 Content 1. Product Introduction .......................................................................................................................... 3 1.1 Introduction ..................................................................................................................................... 3 1.2 Application ....................................................................................................................................... 3 1.3 Main Characteristics ....................
3 1. Product Introduction 1.1 Introduction REX3B21 is a low-power ZigBee module with high sensitivity and compact in dimension. Based on EFR32 platform of SiliconLabs, this module conforms to IEEE 802.15.4 specification and ZigBee3.0 protocol standard. It has been widely used in applications of smart home, building automation and industrial monitoring. By utilizing this module, much time and energy will be saved during the development work. 1.2 Application REX3B21 module conforms to IEEE 802.15.
4 Multiple antenna options Extreme low power consumption Sleep mode：<5.0µA Receiving mode：9.4mA (Zigbee) 15 GPIOs can be configured for various functional interfaces according to application GPIO External interrupts 12 bytes precision ADC sampling channel USART Hardware flow control TWI interface UART / SPI / I2C interface PWM output 1.4 Product Advantage Small Package fits small devices well.
5 RTS/CTS Request to Send/ Clear to Send RX Receiver SMA Surface Mount Assembly SPI Serial Peripheral Interface TX Transmitter UART Universal Asynchronous Receiver/Transmitter ZigBee PRO Wireless networking standards targeted at low-power applications 1.6 Related Documents [1] ZigBee 3.
6 2. Product Overview 2.1 Overview REX3B21 is a compact IOT module, higher sensitivity and lower power. It conforms to IEEE 802.15.4 and ZigBee 3.0 standard protocol. Based on EFR32 platform of SiliconLabs, this module has outstanding RF characteristics, lower power consumption, and powerful processor core. REX3B21 module conforms to the FCC, ISED, CE, and RoHS, which can be applied to various devices in different environments.
7 3. Technical Specification 3.1. Electrical Specification 3.1.1. Electrical Specification Table 3-1. Absolute Maximum Ratings Parameter Min Max Module input voltage（VCC） 1.71V 3.8V Pin voltage (except ADC pin) -0.3V VDD_PADS+0.3 0V 3.3V ADC Pin voltage Data of maximum drive current of all I/Os 50 mA Maximum RF signal receiving density of chips +14 dBm Note: exceeding the absolute maximum ratings may damage module.
8 3.1.3. RF Electrical Characteristics Table 3-3. RF Electrical Characteristics Parameter Frequency range Range Unit 2400~2483.5 MHz Quantity of Channels 16 Channel spacing 5 MHz Transmitting power 14 dBm Receiving sensitivity -102.5 dBm Max transmitting rate 250 kbps Rated Input / Output Impedance 50 Ω 3.1.4. Processor Characteristics Table 3-4. Processor Characteristics Parameter Processor core 32bit ARM®-M33 Max operating frequency 80MHz 3.1.5.
9 3.2. Physical/Ambient Characteristics Table 3-6. Physical/Ambient Characteristics Parameter Physical size Value 20.4*14.8*2.5mm <1g Weight Working temperature -40°C to +85°C（default） <95% Relative working Humidity 3.3. Pin Configuration Figure3-1.
10 Figure3-2. Footprint Figure 3-3. Pin Definition Table 3-7.
11 No. of No. of QFN32 module pins package pins 1 Pin signal Direction Pin specification 1 PC0 I/O GPIO 2 2 PC1 I/O GPIO 3 22 PA5 I/O GPIO; TXD 4 23 PA6 I/O GPIO; RXD 5 10，25，26，27 3.
12 3.4 Antenna Specification 3.4.1 On Board PCB Antenna REX3B21 has an on board PCB antenna. Notes for using PCB antenna: Avoid placing module in a metal shell. Keep metal object from the PCB antenna (at least 1cm above, 2.7cm plus recommend). Do not keep module nearby the devices with electromagnetic radiation source, such as transformers. The design of a user's PCB should prevent the module’s PCB antenna from the interference of its components, traces and bottom.
13 3.5. RF Performance Figure 3-8. Carrier Signal Figure 3-9.
14 3.6. Soldering Temperature for Module The max temperature for soldering module shall be within 237-245℃ in 20s.
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16 3.7.
17 4.
18 5. Contact Us Zhejiang Rexense IoT Technology Co., Ltd. Add： 6F, Building No.4, No.6 Longzhou Road, Yuhang District,Hangzhou,311100, China Tel：+86-571-28081053 Email: intl@rexense.com Web：www.rexense.
19 FCC Compliance Notice This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
20 applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. ISEDC Radiation Exposure Statement: This equipment complies with ISEDC RF radiation exposure limits set forth for an uncontrolled environment.
21 Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular. 2.3 Specific operational use conditions This module is stand-alone modular.
22 Commission to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. 2.8 Label and compliance information The final end product must be labeled in a visible area with the following " Contains FCCID:2AOE2-REX3B21” 2.
23 and the ISED cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate Canada authorization.
24 IC:22670-REX3B21. Plaque signalétique du produit final Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: Contient des IC:22670-REX3B21. Manual Information to the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
25 Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Cet émetteur radio [22670-REX3B21] a été approuvé par Innovation, Science et développement économique Canada pour fonctionner avec les types d’antenne énumérés ci-dessous. Il dispose d'une antenne avec une prise le gain maximum d'antenne est de1.78 dBi.
