Specifications

ManualsBrandsXIAMENSHI C-CHIP ManualsElectronicsBluetooth Module

Specification

Product name : Bluetooth module

Product model：F-9689

Document No：

Document Version：V1.1

date：2019-01-02

File include (C-CHIP) confidential documents, without permission, can not be disclosed

1.Product overview：

F-9689 Bluetooth module is an intelligent wireless audio data transmission

product independently developed by our company. It is a low cost and high

cost-effective MESH scheme. The module adopts highly integrated single-mode data

transmission module of Bluetooth 5.0 chip BK3431Q QFN40, built-in

high-performance transceiver and powerful baseband processor. Built-in FLASH

program memory for customized applications, better protection of the security

of the application (suitable for small data transmission, support MESH, mainly

for control).

2.Application area：

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Summary of content (8 pages)

PAGE 1
Specification Product name : Bluetooth module Product model：F-9689 Document No： Document Version：V1.1 date：2019-01-02 Edit Review Approve File include (C-CHIP) confidential documents, without permission, can not be disclosed 1.Product overview： F-9689 Bluetooth module is an intelligent wireless audio data transmission product independently developed by our company. It is a low cost and high cost-effective MESH scheme.
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The module is mainly used for wireless network communication, the main applications include: location tags, asset tracking, sports and fitness sensors, medical sensors, smart watches, remote controls, toys, light etc. ※ Mobile phone accessories ※ Sports and health equipment ※ Health care and medical equipment ※ Family and building automation ※ Consumer electronics 4.
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13 GND GND GND 14 GND GND GND 15 BAT Power Power 16 P25 Digital I/O General purpose IO 17 P00 Digital I/O GPIO0/UART1_TXD 18 P01 Digital I/O GPIO1/UART1_RXD 19 P02 Digital I/O General purpose IO/I2_SCL 20 P03 Digital I/O General purpose IO/I2_SDA/JTAG_NTRST 21 P04 Digital I/O General purpose IO/SPI_SCK/JTAG_TDI 22 P05 Digital I/O General purpose IO/SPI_MOSI/ JTAG_TD0 23 P06 Digital I/O General purpose IO / SPI_MISO/ JTAG_TCK 24 P07 Digital I/O General purpose I
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F. suggests the module antenna part floating on the floor, do not go around the antenna control line, power line, audio line, MIC interference lines; G. If the module antenna near the row seats, Because of metal will block the signal transmission, it is recommended to use professional high-gain antenna. 11.Recommended reflow temperature： Key features of the profile: -Initial Ramp=1-2.
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(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.107) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.
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Module statement The single-modular transmitter is a self-contained, physically delineated, component for which compliance can be demonstrated independent of the host operating conditions, and which complies with all eight requirements of § 15.212(a)(1) as summarized below. 1) The radio elements have the radio frequency circuitry shielded. 2) The module has buffered modulation/data inputs to ensure that the device will comply with Part 15 requirements with any type of input signal.