IMQ3 module user manual Project Name: IMQ3 series Module Author: Wistron NeWeb Corporation Revision: 0.
Product Technical Specifications Contact Information Technical Support website https://SupportIoT.wnc.com.tw Company Website www.wnc.com.tw Revision History □ Normal Rev. # Author Summary of Changes Date 0.1 WNC Draft release 2018/12/25 0.2 WNC Add FCC/IC Statement 2019/4/23 0.3 WNC Remove the function diagram 2019/5/6 0.
Product Technical Specifications © Wistron NeWeb Corporation THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PROPRIETARY AND IS THE EXCLUSIVE PROPERTY OF WNC AND SHALL NOT BE DISTRIBUTED, REPRODUCED, OR DISCLOSED IN WHOLE OR IN PART WITHOUT PRIOR WRITTEN PERMISSION FROM WNC. LIMITATION OF LIABILITY THIS DOCUMENT AND THE INFORMATION CONTAINED HEREIN IS PURELY FOR DESIGN REFERENCE AND SUBJECT TO REVISION BY WNC AT ANY TIME.
Product Technical Specifications Contents Contact Information.................................................................................................................2 Revision History........................................................................................................................2 Contents....................................................................................................................................4 1. Introduction........................................
Product Technical Specifications 3.7. 4. SPI Master Interface.............................................................................. 30 3.6.5. PCM Interface........................................................................................ 31 3.6.6. I2S Interface........................................................................................... 33 3.6.7. I2C Interface...........................................................................................34 3.6.8.
Product Technical Specifications 6.8. PCB pad design................................................................................................... 51 6.9. Stencil................................................................................................................. 52 6.10. Antenna design requirement..............................................................................54 7. Labeling and Packaging....................................................................................
Product Technical Specifications 1. Introduction The WNC IMQ3 series modules are includes the Qualcomm MDM9206 Cat. M1 baseband, a complete LTE RF front-end, memory, and required circuitry to fulfill 3GPP E-UTRA (Long Term Evolution - LTE, Rel-13 specifications). IMQ3 series modules provide a variety of interfaces including USB, SPI, UART, PCM, I2C, UIM. 1.1.
Product Technical Specifications – – – – – I2C/SPI interface USIM interface GPIOs ADC PCM/I2S 1.3. Module Connection Interface The IMQ3 modules are LGA device. All electrical and mechanical connections are made through the 104 pads on the bottom side of the PCB. Figure 1. LGA pad 1.4. Environmental Specifications and Certifications 1.4.1. Environmental Specifications The environmental specifications for both operating and storage conditions are defined in the table below.
Product Technical Specifications 1.4.2. Certifications The IMQ3 module is compliant with the following regulations: PTCRB, GCF, FCC, IC, AT&T, Verizon and Sprint. 1.4.3.
Product Technical Specifications 2. Pin Definitions 2.1. LGA Module Pin Diagram The IMQ3 LGA module pin layout is illustrated below. Figure 2.
Product Technical Specifications 2.2. LGA Module Pin Definitions The signals and all the related details are listed in the below table. Table 2. module pin definitions Pin No. PIN Definition □ Normal Voltage Level (V) Min. Typ. Max.
Product Technical Specifications □ Normal 28 GND - 0 - 29 GND - 0 - 30 GND - 0 - 31 GND - 0 - 32 GND - 0 - 33 NC - - - 34 GND - 0 - 35 GND - 0 - 36 GND - 0 - 37 VCC1 3.3 3.8 4.2 38 VCC2 3.3 3.8 4.2 39 VCC3 3.3 3.8 4.2 40 VCC4 3.3 3.8 4.2 41 VCC5 3.3 3.8 4.2 42 VCC6 3.3 3.8 4.2 43 NC - - - 44 GND - 0 - 45 GND - 0 - 46 PCM_SYNC/GPIO46 (RFU) 1.7 1.8 1.9 47 PCM_DIN/GPIO47 (RFU) 1.7 1.8 1.
Product Technical Specifications □ Normal 63 SPI_MISO 1.7 1.8 1.9 74 GND - 0 - 75 GND - 0 - 76 NC - - - 77 NC - - - 78 NC - - - 79 NC - - - 80 UART1_CTS (UART 1) 1.7 1.8 1.9 81 UART1_RTS (UART 1) 1.7 1.8 1.9 82 UART1_RX (UART 1) 1.7 1.8 1.9 83 UART1_TX (UART 1) 1.7 1.8 1.9 84 GND - 0 - 85 GND - 0 - 86 USB_Dp - Note6 - 87 USB Detect 1.7 1.8 1.
Product Technical Specifications □ Normal 108 GND - 0 - 109 GND - 0 - 120 NC - - - 121 NC - - - 122 AD Converter 0.1 - 1.7 123 NC - - - 124 NC - - - 125 NC - - - 126 NC - - - 127 NC - - - 128 NC - - - 129 GPIO05 1.7 1.8 1.9 130 GPIO06 1.7 1.8 1.9 131 NC - - - 132 NC - - - 133 UIM_VCC 1.7/2.7 1.8/3.0 1.9/3.3 134 UIM_DATA 1.7/2.7 1.8/3.0 1.9/3.3 135 UIM_CLK 1.7/2.7 1.8/3.0 1.9/3.3 136 UIM_RESET 1.7/2.7 1.8/3.0 1.
Product Technical Specifications □ Normal 206 NC - - - 207 NC - - - □ Internal Use Confidential □ Restricted Confidential 15 / 65
Product Technical Specifications 3. Electrical Specifications 3.1. Power supply The IMQ3 modules are supplied through the power signal with the following characteristics. Table 3. Power supply 3.2. Direction Vmin Typical Vmax Power (37–42) In 3.3 V 3.8 V 4.2 V VREF Out 1.71 V 1.8 V 1.89 V UIM_VCC Out 1.71 V 1.8 V 1.89 V 2.85 V 3.0 V 3.15 V Power consumption This section describes typical power consumption of IMQ3 for reference. The current data is measured at 3.8V VCC.
Product Technical Specifications LTE Band 1 working mode Max Tx power without throughput, Power voltage 3.8 V; average current, CMW500 eMTC mode. 173mA LTE Band 2 working mode Max Tx power without throughput, Power voltage 3.8 V; average current, CMW500 eMTC mode. 171mA LTE Band 3 working mode Max Tx power without throughput, Power voltage 3.8 V; average current, CMW500 eMTC mode. 156mA LTE Band 4 working mode Max Tx power without throughput, Power voltage 3.8 V; average current, CMW500 eMTC mode.
Product Technical Specifications Max Tx power without throughput, Power voltage 3.8 V; average current, CMW500 eMTC mode. 164mA LTE Band 18 working mode Max Tx power without throughput, Power voltage 3.8 V; average current, CMW500 eMTC mode. 173mA LTE Band 19 working mode Max Tx power without throughput, Power voltage 3.8 V; average current, CMW500 eMTC mode. 179mA LTE Band 20 working mode Max Tx power without throughput, Power voltage 3.8 V; average current, CMW500 eMTC mode.
Product Technical Specifications Low power Mode Max Tx power without throughput, Power voltage 3.8 V; average current, GSM900 281mA Max Tx power without throughput, Power voltage 3.8 V; average current, DCS1800 236mA Max Tx power without throughput, Power voltage 3.8 V; average current, PCS1900 220.55mA Conditions Result Idle mode LTE Standby, 1.28s 1.66mA LTE Standby, 2.56s 1.307mA LTE standby 10MHz w/81.92s 0.902mA e-DRX mode e-DRX PTW 20.48 and DRx 2.
Product Technical Specifications 3.3. I/O Interface I/O type description: AO : Analog Output AI : Analog Input DO : Digital Output DI : Digital Input Table 4.
Product Technical Specifications SPI_EN_1 SPI chip select DO I2C_SCL Clock signal DO SPI_CLK SPI serial clock DO SPI_MOSI SPI master out slave in DO NC NC - SPI_MISO SPI master in slave out DI WWAN_STATE Wireless WAN Radio State DO POWER_ON Power On the module DI WAKEUP_OUT Module wakes up host DO WAKEUP_IN Host wakes up module DI RESET Reset the module DI VREF Voltage Reference Output AO VCC Main Power AI GND GND AI GPIO Digital I/O DI/DO ADC_CONVENTOR ADC_CON
Product Technical Specifications Notes: *2. Do not pull pin143 WAKEUP_OUT to high; otherwise boot will fail. *3. Pull Pin144 WAKEUP_IN to VREF with a 100k resistor and keep it high before system boot process is complete. *4. Pull pin142 POWER_ON to VREF with a 100k resistor for stability considerations. *6. Refer to section 2.3, for more information please check USB2.0 standard *8.
Product Technical Specifications Table 6. I/O default setting table □ Normal Pin No.
Product Technical Specifications 3.4. USB interface The IMQ3 series modules comply with USB 2.0 high-speed protocol. The USB input/output lines follow USB 2.0 specifications. Table 7. Signals of the USB interface Name Description Input/Output (Direction to module) Voltage Level (V) Min. Typ. Max. D+ USB data positive (low-/full-speed) Input High 2 Input Low 0 Output High 2.8 3.3 3.6 0.8 3.3 Output Low 3.6 0.3 USB data positive (high-speed) Input High 0.3 0.44 Input Low 0 0.
Product Technical Specifications 3.5. UIM interface IMQ3 series modules provide an UIM_DETECT input pin for UIM connector to detect UIM card. When UIM card is present, UIM_DETECT should be high(1.8V). If UIM card is absent, UIM_DETECT should be low. It’s required to pull UIM_DETECT to VREF with a 470k resistor. A 0.1μF and a 33pF capacitor are recommended to place between UIM_VCC and Ground in parallel.
Product Technical Specifications □ Normal □ Internal Use Confidential □ Restricted Confidential 26 / 65
Product Technical Specifications □ Normal □ Internal Use Confidential □ Restricted Confidential 27 / 65
Product Technical Specifications 3.6. Control interface This section describes the power-on/off, wake-up and reset interface on how to control the module. 3.6.1. Power-on/ WAKEUP_IN Signal The POWER_ON is an active Low input signal used to enable or disable the module. Do not toggle the PERST# pin during power-on. This signal has the highest priority over the wakeup, the alarms signals, and the digital control pins. There are three possible states of the module: Module Off - VCC is not present.
Product Technical Specifications POWER_ON pad will enable the module after VCC is applied. Figure 4. Power ON/OFF timing After module power on, it also can wakeup the module in PSM deep sleep mode if host want to transmit data. WAKEUP_IN description: (Host: Output, Modem: Input) – HIGH: Host does not require the modem (allowing it to enter PSM deep-sleep mode). – LOW: If the modem is in PSM deep-sleep mode, set this pin to low level will wakeup the modem. 3.6.2.
Product Technical Specifications module, see figure7. Figure 5. Reset Signals circuit 3.6.4.
Product Technical Specifications Timing Figure 6. SPI timing parameters 3.6.5. PCM Interface IMQ3 series modules provide one PCM master digital audio interface. Keep PCM signal traces far away from noise and radiating signal on PCB Figure 7.
Product Technical Specifications Timing Figure 8. PCM timing diagram Figure 9.
Product Technical Specifications 3.6.6. I2S Interface PCM and I2S share the same pins on the modules, I2C only support master mode, keep I2S signal trace far away from noise and radiating signal on PCB Config1 Config2 PCM_SYNC PCM_DIN PCM_DOUT PCM_CLK I2S_WS I2S_DATA0 I2S_DATA1 I2S_SCK Figure 10.
Product Technical Specifications Figure 11. Figure 12. 3.6.7. I2S timing diagram I2S timing parameters I2C Interface IMQ3 series modules provide one I2C interface, I2C only support master mode. Figure 13.
Product Technical Specifications 3.6.8. UART Interface There are dual UART interfaces. One is 4 bit for high-speed data transfer, and the other is 2 bit for diagnostic tools and debugging. Recommended to reserve a pull down 1kΩ resistor on UART1_RTS signal near IMQ3 module Figure 14. 3.6.9. Recommended circuit for UART interface (4 bit) with Level Shifter ADC Interface An Analog to Digital Converter (ADC) input is provided by the IMQ3 series. The converter is 16 bit resolution, ranging from 0.
Product Technical Specifications Layout suggestion: ADC signal trace should be well protected by GND plane ADC signal trace should be protected from noise and other radiating signals 3.7. RF Specifications 3.7.1. Band support Table 8.
Product Technical Specifications 3.7.2. GSM900 880-915 925-960 DCS1800 1,710-1,785 1,805-1,880 PCS1900 1,850–1,910 1,930–1,990 Bandwidth support Table 9. Bandwidth support Band Bandwidth 1.
Product Technical Specifications LTE Band 13 Max. TX Power 10 MHz 4 RBs/QPSK dBm 20.3 23 25.7 LTE Band 18 Max. TX Power 10 MHz 4 RBs/QPSK dBm 20.3 23 25.7 LTE Band 19 Max. TX Power 10 MHz 4 RBs/QPSK dBm 20.3 23 25.7 LTE Band 20 Max. TX Power 10 MHz 4 RBs/QPSK dBm 20.3 23 25.7 LTE Band 25 Max. TX Power 10 MHz 4 RBs/QPSK dBm 20.3 23 25.7 LTE Band 26 Max. TX Power 10 MHz 4 RBs/QPSK dBm 20.3 23 25.7 LTE Band 28 Max. TX Power 10 MHz 4 RBs/QPSK dBm 19.8 23 25.
Product Technical Specifications GSM Band Items EGPRS850(MCS9) EGPRS900(MCS9) Parameter Unit Typ. 3GPP limit RX Sensitivity - dBm -91 –86 RX Sensitivity - dBm -91 –86 EGPRS1800(MCS9) RX Sensitivity - dBm -91 –86 -91 –86 EGPRS1900(MCS9) RX Sensitivity dBm Note: 1. The RF Receiver Specification is defined at the LGA pad. 2. IMQ3 series meet 3GPP TS 36.521-1/TS 34.121-1 test standard. 3.7.5. GNSS Receiver Specification Table 12. GNSS receiver performance Test items Parameter Min.
Product Technical Specifications 4. Software Interface 4.1. Support tools The IMQ3 series modules are compatible with the following support tools: WNC IMQ3 Connection Manager (WNCCM) (TBD) 4.2. USB interface The IMQ3 series modules support 3GPP standard AT commands and proprietary AT commands.
Product Technical Specifications 5. Mechanical 5.1. PCBA Form Factor IMQ3 series modules have the same dimensions: 26.3 mm (typ.) × 23.1 mm (typ.) × 2.56 mm (typ.) Top view Figure 15.
Product Technical Specifications Figure 16.
Product Technical Specifications Figure 17. Recommend PCB footprint Figure 18.
Product Technical Specifications 6. Design Guide 6.1. Power supply LTE module power input is VCC. The internal power chipset will transfer VCC to other power level. Table 13. Power supply voltage level Power Pin Name Pads Description VCC VCC1 to VCC6 Nos. 37 to 42 Main Power Supply Voltage Level (V) Min. Typ. Max. 3.3 3.8 4.2 The IMQ3 series module include an integrated power manager enabling single and direct voltage supply from the battery, reducing the overall bill of materials.
Product Technical Specifications Layout Suggestion: 6.2. The 22μF, 0.1uF, 12pF and 8pF capacitors are required to place near VCC pins as close as possible.
Product Technical Specifications Design points used to improve the thermal performance: It’s better to add a naked copper area onto IMQ3 modules’ back side of the PCB. If the thermal performance becomes an issue in the customer’s product, add thermal solutions for improvement such as a thermal pad or a heat sink. It’s recommended to have a thermal pad or a heat sink on shielding cover to help transfer heat.
Product Technical Specifications ANT_GNSS pad (Pin9) – GNSS path (optional) It is recommended that grounds not be present under the surface of the RF pads in the layout. Details are included below. Layer2 has the same keep out size as Layer1 Figure 19.
Product Technical Specifications Figure 20. RF matching guide 6.5. Interference and sensitivity This section includes tips to assist developers in identifying the interference that may affect IMQ3 series modules when used in systems. Interference from other wireless devices – Harmonics, inter-modulated signal generated from wireless devices that fall in RX ranges of the modules, may result in degraded RX performance.
Product Technical Specifications module to the antenna should be as short as possible and must be shielded by complete grounding. – The IMQ3 series modules are well shielded; the high-speed elements (Ex.: DDR memory, LCD modules, DC-DC converter, PCM signal) on a system should have shielding reserved during the early stages of development.
Product Technical Specifications The following SAW filter and LNA components have been implemented by WNC development board. SAW filter1: Murata SAFFB1G56KB0F0AR15 LNA: INFINEON BGA824N6 SAW fiter2: Murata SAFFB1G56KB0F0AR15 In the reference design, Pin146 (VREF,1.8V) of module supply to the LNA BGA824N6 for power supply. Pin129 (GPIO05) of module is feed to LNA enable control pin. It is as default in the module FW. 6.7.
Product Technical Specifications 81.48 –34% Melt-out Time/230°C 46.91 -31% Max Temp 240.40 4% Total Time/217°C 81.18 -15% Gradient1 (100–150°C) 1.88 25% 81.13 –36% 81.94 –32% 79.07 –48% 2.87 49.26 -7% 53.50 35% 48.18 –18% 6.59 241.34 13% 241.84 18% 241.32 13% 1.44 82.95 -8% 87.61 10% 81.24 –15% 6.43 1.91 28% 1.87 25% 1.86 24% 0.05 Process limit: Solder Paste Lead-free Profile feature Gradient1 (Target = 1.
Product Technical Specifications Figure 22. NSMD solder pad design It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3 mm around the pads unless it carries the same signal of the pad itself, see following figure. Holes in pad are allowed only for blind holes and not for through holes. 6.9. Stencil 0.15mm stencil-foil thickness is recommended to obtain the best performance to prevent voids during SMT reflow, 0.
Product Technical Specifications Figure 23.
Product Technical Specifications 6.10.
Product Technical Specifications 7. Labeling and Packaging 7.1. Labeling Figure25 shows label drawing of IMQ3 series modules. Figure 24. Label drawing 7.2. Packing Tape-and-Reel Package The module is delivered in tape-and-reel based on MPQ (500 pcs./reel).4 reel/carton.
Product Technical Specifications □ Normal □ Internal Use Confidential Figure 25. Packing--tape Figure 26.
Product Technical Specifications Single Packaging for Samples 50 pcs./box; no vacuum packaging; must be baked for 8 hours at 85 °C before SMT at least. Figure 27. 7.3. Packing—carton MSL level The IMS2 module MSL level is 3.
Product Technical Specifications 8. Safety Recommendation Be sure the use of this product is allowed in the country and in the environment required.
Product Technical Specifications Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules.
Product Technical Specifications Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Product Technical Specifications Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Industry Canada statement □ Normal This device complies with Industry Canada license-exempt RSS standard(s).
Product Technical Specifications Canada. La fonction de sélection de l'indicatif du pays est désactivée pour les produits commercialisés aux États-Unis et au Canada. Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Product Technical Specifications l'antenne et les utilisateurs, et 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé.
Product Technical Specifications Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
Product Technical Specifications Initialisms Table 14.
