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WiSe 1230BLE Module Technical Specification

WiSilica Inc

WiSe 1230 Hardware and Technical Specification

Version (Rev 1.5)

Issued: 14/06/2017

Summary of content (11 pages)

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WiSe 1230BLE Module Technical Specification WiSe 1230 Hardware and Technical Specification Version (Rev 1.
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WiSe 1230BLE Module Technical Specification Table of Contents General Information ............................................................................................................................... 4 Features .............................................................................................................................................. 4 General Description ............................................................................................................................
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WiSe 1230BLE Module Technical Specification Revision History Rev No Rev 1.0 Rev 1.1 Rev1.2 Rev1.3 Rev1.4 Rev1.5 WiSilica Inc Date 05/01/2017 07/02/2017 14/02/2017 23/02/2017 17/04/2017 14/06/17 Notes Draft Release BLE chip partnumber corrected Block diagram and External antenna guide included. Land Pattern Dimension added. PCB Antenna description removed. Module Host details added.
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WiSe 1230BLE Module Technical Specification General Information Features           Bluetooth v4.0 specification complaint Support for Bluetooth 4.1 specification host stack 512KB of Flash memory 12 MHz and 32MHz clock system PWM/SPI/GPIO/UART/I2C interface TX output power upto +5dbm -92dbm BT4.
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WiSe 1230BLE Module Technical Specification Application: WiSe 1230 enables connectivity and data transfer to leading smartphone, tablet and personal computing devices including Apple iPhone, iPad, iPod and Mac products and leading Android devices.        Smart mesh light application Smart home heating and lighting control Health sensors like blood pressure, thermometer and glucose meter Beacons Security Sensors Wearable devices. Form factor:  Dimension: 23.
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WiSe 1230BLE Module Technical Specification  Keep plastic enclosures 1cm or more away from the antenna in any direction.
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WiSe 1230BLE Module Technical Specification 23 24 SPI_MISO SPI_MOSI O I SPI data output or Programmable I/O SPI data input or Programmable I/O Electrical characteristics Absolute Maximum Ratings Ratings Min Max Storage Temperature -65°C 125°C Supply voltage 2.2V 3.6V Recommended operating condition Item Min Typical Max Operating Temperature -40 - 125°C Supply voltage 2.2V 3.3V 3.6V IO Supply Voltage V - 3.6V AIO Ratings Min Max Input Voltage 0.7 3.3V Output voltage V 3.
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WiSe 1230BLE Module Technical Specification RF Characteristics: Path Description Operating Frequency Conditions Min 2402 Maximum output power TX Max Unit 2480 MHz 7 dBm 2nd harmonic 54 dBuV 3rd harmonic 54 dBuV 275 kHz Modulation delta F1 average 225 Modulation delta F1 / F2 0.
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WiSe 1230BLE Module Technical Specification Recommended Land Pattern Dimension:     Dimension: 23.45x15mm Pitch: 1.5mm Pad dimension: 0.96x0.96mm Height:3.4mm(includes shield) Host details: The WiSe1230 module is going to be embedded with Multisensor Multisensor Multisensor is the one which contains PIR (ALS312), LDR (TEMT6000)RTC (HYM8563) and WiSe1230 module. It is intended to be a general purpose remote control that contains PIR, Ambient light sensor, Real time clock.
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WiSe 1230BLE Module Technical Specification Best practices When designing with WiSe1230 modules, please pay attention to the following recommendations      While integrating module make sure all the module pads are soldered properly. The module's voltage requirement is 2.5 to 3.6V, if the power supply is over 3.3V, please use a voltage regulator. If the communicating host uses a different voltage then the BLE module, please make sure that the voltage matches on the communication ports.
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(OEM) Integrator has to assure compliance of the entire end-product incl. the integrated RF Module. For 15 B (§15.107 and if applicable §15.107) compliance, the host manufacturer is required to show compliance with 15 while the module is installed and operating. Furthermore the module should be transmitting and the evaluation should confirm that the module's intentional emissions (15C) are compliant (fundamental / out-of-band). Finally the integrator has to apply the appropriate equipment authorization (e.