Brochure/Catalogue
7
Reliable processing
To maximise dimensional stability and ensure accurate grid alignment, we make
our SMD components from the high-performance plastic LCP. This material offers
high dimensional stability and excellent solder heat resistance. Our SMD
connection system thus ensures a reliable, smooth SMD process. With their low
moisture sensitivity level (MSL 1), you can process our components without pre-
drying. Their low thermal expansion coefcient also prevents an assembly from
being deected during the soldering process, thus speeding up your fully
automated assembly process.
Stable solder joint
Our LSF-SMD PCB terminals guarantee a secure hold on the circuit board thanks
to the use of two solder pads per pole – even without additional mounting
anges. Holding forces per pin of over 150 N in an axial direction withstand even
heavy loading. Simulated endurance tests conrm the high vibration and shock
resistance of our products according to IEC 61373/10.2011, assuring you of
asmooth and maintenance-free SMT process over the long term. Even secure
integration on composite boards made of glass, ceramics or aluminium is
unproblematic.
Efcient assembly
Our components with pick-and-place pads and suction surfaces support secure
mounting and precise placement in fully automated assembly. With their light
weight, our SMD-optimised PCB terminals also maximise assembly performance.
You benet from simple integration of the connection elements in the assembly
process with tape-on-reel packaging in standard conveyor widths. They are
designed for automation and contain a very high number of components per roll.
This reduces your setup costs in automated SMD processes.