Approval/Certificate/Document of Conformity

Certificate: 70153051
Project: 70153051
Master Contract: 200039
Date Issued: 2017-09-27
DQD 507 Rev. 2016-02-18 Page 3
Conditions of Acceptability:
1.
Insulation materials
The following materials are used, see description for details:
id
Type designation
Manufacturer
UL file
no.
CTI [V]
Thickness
[mm]
Flame
Class
RTI °C]
Elec/Str
1
Wellamid 6600-PA66-
HWV0CP
CP-Polymer-Technik
E63957
600 and
greater
0.4
V-2
130/120
2
6140L
CELANESE
INTERNATIONAL
CORP
E344082
175
through
249
0.4
V-0
130/130
3
A63 V0GV
Nilit Plastics Europe
GmbH & Co KG
E86034
600 and
greater
0.75
V-0
130/130
4
Grilon XE5017
EMS-CHEMIE AG
E53898
600 and
greater
0.8
V-0
120/140
2.
These terminal blocks consist of a construction that exposes the live screw underneath the terminal block.
Spacings were not measured from the bottom of the screw to the terminal block-mounting surface, since the
terminal block is intended to be mounted to a circuit board (utilizes solder post). Spacing measurements are
recommended as part of the end product investigation, if the terminal is mounted to a surface other than a printed
circuit or if printed circuit board traces are routed under the terminal block.
3.
For a 2 piece terminal block, a header having a voltage rating less than the detachable terminal block, may be used
at the higher voltage when subjected to a suitable evaluation for the higher voltage in the end-use investigation.
4.
Terminal block type BHF 5.00 and Header SHL – SMT 5.00 are intended to be used with the housing types
CH20M12, CH20M17, CH20M22 and CH20M45 as a part of a system. The housings CH20M12, CH20M17,
CH20M22 and CH20M45 are intended by the manufacturer to be used for UL508 applications. The plastic
material fulfills the requirements for direct support of uninsulated live parts according table 15.1 of the standard
UL 508 in the areas capped by the intended PWB-contour and has a minimum thickness of 1.2 mm in these areas
with a related RTI Elec of 120. The suitability of the housings shall be judged in the end-use application.