Datasheet

210
2
10 20 30 40 50 60 70 80 90 100 105
0
5
10
15
20
Additional approvals and corresponding ratings can be found at www.wago.com. For additional technical information, see Section 13.
SMD PCB Terminal Blocks with Push-Buttons, 0.75 mm
2
Pin Spacing: 4 mm
2060 Series
Technical data:
Pin Spacing
4 mm
0.157 in.
Ratings per
IEC/EN 60664-1
Overvoltage category
III III II
Pollution degree
3 2 2
Rated voltage
63 V 160 V 320 V
Rated surge voltage
2.5 kV 2.5 kV 2.5 kV
Nominal current
9 A 9 A 9 A
Approvals per UL 1977
Rated voltage, 1-pole 600 V
Rated voltage, 2 or more poles 320 V
Nominal current UL 9 A
Material data:
Material group I
Insulating material Glass-fiber-reinforced polyphthalamide (PPA GF)
Flammability class per UL 94 V0
Lower/Upper limit temperature -60 °C / +105 °C
Contact material Copper alloy
Contact plating tin-plated
Conductor data:
Connection technology Push-in CAGE CLAMP
®
Conductor size: solid 0.2 … 0.75 mm
2
Conductor size: fine-stranded 0.2 … 0.75 mm
2
Conductor size: fine-stranded 0.25 … 0.34 mm
2
(with insulated ferrule)
Conductor size: fine-stranded 0.25 … 0.34 mm
2
(with uninsulated ferrule)
AWG 24 … 18
Strip length 7 … 9 mm / 0.28 … 0.35 in.
Conductor entry angle 0° to PCB
2060 Series accessories: Page:
Operating tool (206-860) 218
Operating tool (2060-189) 218
Current-Carrying Capacity Curve
Pin spacing: 4 mm / Conductor size: 0.75 mm
2
“f-st”
Based on: EN 60512-5-2 / Reduction factor: 1
Ambient operating temperature in °C
Conductor rated current
2-, 4-, 6-pole
Current in A
● SMD PCB terminal blocks with Push-in CAGE CLAMP
®
and push-buttons
● Push-in termination of solid and ferruled conductors
● Convenient termination/removal of fine-stranded conductors via
push-buttons
● Just 4.5 mm high
● Available in tape-and-reel packaging for automated assembly
● For THR version, see page 123.
Application notes:
Suitable for lead-free, reflow-soldering profiles acc. to DIN EN 61760-1 and IEC 60068-2-58 up to max. 260 °C peak
temperature. Due to customer specific variables (e.g., component configuration and orientation, type of soldering machine,
solder paste), it is recommended that trial runs are conducted to ensure product and process compatibility under actual
manufacturing conditions.

Recommendation for stencil: Material thickness, 150 µm. Pattern layout identical to solder pad layout.