BTA3X Module Specification BTA3X Specification 1 / 25
BTA3X Module Specification ➢ Document History Version V0.1 V0.2 Date 2021-03-08 2021-05-25 Person KEN KEN V0.3 V0.4 V0.5 2021-10-08 2021-12-29 2022-01-18 KEN KEN KEN V0.6 2022-04-02 KEN Remarks Draft version Modified the following items - 3. Module Pin Description - 4. Module Size - operating temperature and storge temperature - 7. RF Characteristics - 8.2 Module Placement Guidelines Modified operating temperature in 6.2 Added 6.3 part Modified the description in 6.
BTA3X Module Specification ➢ Directory 1. Product Overview 1.1 Product Description 2. Product Features 3. Module Pin Description 4. Module Size 5. Power On/Off Sequence 6. Electrical Characteristics 6.1 Absolute Maximum Ratings 6.2 Recommended Operating Conditions 6.3 Digital terminals 6.4 Clock Frequency 6.5 Power Consumption 7. RF Subsystem 7.1 Radio Transceiver 7.2 Transmitter and Receiver specifications 7.3 Antenna Performance 7.3.1 VSWR, Return Loss, Impedance 7.3.2 Antenna 3D Radiation Pattern 8.
BTA3X Module Specification 9. Handing Precautions 9.1 Recommended Reflow Profile 9.2 Storage and Baking Conditions 10. Reference Application Schematic 11. Module Label Specification 12. Certification 12.1 Bluetooth Certification 12.2 Radio Certification 13.
BTA3X Module Specification ➢ 1. Product Overview The purpose of the Specification is to provide the design, manufacture and other related technical information for BTA3X Bluetooth module. 1.1 Product Description BTA3X is a stereo audio module solution that support Bluetooth 5.2 dual mode. It is designed and developed by USE Technology (Shenzhen) Co., Ltd. and produced at SUNITEC ELECTRONICS TECHNOLOGY LTD in China.
BTA3X Module Specification ➢ 2. Product Features The BTA3X integrates a wireless Bluetooth chip. It has a high-performance stereo audio codec that can be used to receive audio data wirelessly from Bluetooth source device, like smart phone or PC and output to it via analog or digital audio interface. It also transfers BLE data between apps and the model that adopts BTA3X.
BTA3X Module Specification [Bluetooth and Audio] ・Bluetooth Spec version 5.2 fully qualified. ・Bluetooth Profile: A2DP, AVRCP, HFP, HSP, SPP, BLE MIDI, GAP, GATT A2DP profile version: 1.3.2 compliant AVRCP profile version: 1.6.2 compliant HFP profile version: 1.8 compliant HSP profile version: 1.2 compliant SPP profile version: 1.2 compliant GAP, GATT: core spec 5.
BTA3X Module Specification ➢ 3. Module Pin Description As the following figure shown, BTA3X has 52 stamp pins. Each pin number, pin type and supply is listed in the following table.
BTA3X Module Specification 10 PIO23 Input/Output, Digital Input/Output, Digital Analog Analog Input/Output, Digital Input/Output, Digital Input/Output, Digital Input/Output, Digital Input/Output, Digital Ground Ground Input/Output, Digital Input/Output, Digital Input/Output, Digital Analog Supply, 3V Analog Input, Digital VCCIO Programmable IO 11 PIO25 VCCIO Programmable IO 12 13 14 USB_DM USB_DP PIO19 VCCUSB VCCUSB VCCIO USB data minus USB data plus Programmable IO 15 PIO21 VCCIO Programm
BTA3X Module 37 PIO2 38 39 MIC_BIAS2 RSTN 40 PIO3 41 42 43 SPK_RP SPK_RN VCC_SPK 44 45 46 47 48 49 50 51 52 SPK_LN SPK_LP GND MIC_BIAS MIC_LP MIC_LN MIC_RN MIC_RP GND Specification Input/Output, Digital Analog Input, Digital Input/Output, Digital Analog Analog Supply, 1.
BTA3X Module Specification ➢ 4. Module Size For BTA3X, a 23.52 x 15.30 x 2.50mm, 0.85mm pitch, stamp pin package is offered. The weight of BTA3X module is about 1.3 grams. The package view and size information are shown in following figure. ➢ 5. Power On/Off Sequence The power on/off control method is shown in following timing chart. ※If want to power on BTA3X again after power off via REGEN port control while maintaining VBAT, please wait 4 seconds before controlling REGEN port.
BTA3X Module Specification ➢ 6. Electrical Characteristics 6.1 Absolute maximum ratings Description VCCIO: I/O supply voltage VBAT: System power, Charger output REGEN: Regulator enable VIN: Switching Regulator supply voltage CHG: Charger supply voltage VCCSPK Operating temperature Storage temperature Min. -0.30 -0.30 -0.30 -0.30 -0.30 -0.30 -20 -25 Max. 3.60 4.80 4.80 4.80 6.50 3.60 +70 +85 Unit V V V V V V ℃ ℃ 6.
BTA3X Module Specification 6.4 Clock Frequency Description CRYSTAL REQUIREMENT Nominal Frequency Frequency Stability over Temperature Min. Typ. Max. Unit - 24 ±20 - MHz ppm 6.5 Power Consumption BTA3X module power consumption [Condition] - BTA3X is mounted EVB, Control BTA3X from PC via USB-Serial conversion board. - 3.7V battery voltage, VBAT=3.7V, VCCIO=3.3V, VCCSPK=HV=3.
BTA3X Module Specification ➢ 7. RF Subsystem 7.1 Radio Transceiver BTA3X RF transceiver is a 2.4GHz-band transceiver for Bluetooth headset applications. There are three main components at the core of its functionality: (1). Transmitter (2). Receiver (3). Synthesizer The Baseband Processing Unit supplies the Enable Control signals for each of these functions. The RX input port and TX output port use the same RF terminal so that an external T/R switch is not necessary.
BTA3X Module Specification At the IF part, the down-converted signal is first low-pass filtered by the LPF at the IF part. The signal is then amplified by the VGA, and sent to the ADC for demodulation. The LPF 3dB bandwidth can be adjusted via the RF registers. The LNA and VGA provide more than 80dB gain control range. 7.1.3 Synthesizer The synthesizer is a fractional-N type with an embedded VCO and a loop filter without the need of external components.
BTA3X Module Specification 7.2 Transmitter and Receiver specifications Items Frequency Range RF Output Power - Basic Data Rate RF Output Power - Enhanced Data Rate RF Output Power - Low Energy RF Power Control Gain Step Range RF Receiver Sensitivity - BR RF Receiver Sensitivity - 2DH5 RF Receiver Sensitivity - 3DH5 RF Receiver Sensitivity – BLE 1Mbps Crystal Frequency Calibration Modulation Characteristics Carrier Frequency Drift Units MHz dBm dBm dBm dBm dBm dBm dBm dBm KHz KHz KHz Min.
BTA3X Module Specification 7.3.
BTA3X Module Specification ➢ 8. Layout Guideline 8.1 Recommended for PWB Antenna design Around of the PWM Antenna should keep out of metal over 15mm, so that RF has a good performance. 8.2 Module Placement Guidelines BTA3X has internal PCB pattern antenna, the antenna placement affects the overall performance of the system. The antenna requires free space to radiate RF signals and it must not be surrounded by the ground plane.
BTA3X Module Specification ➢ 9. Handling Precautions This part specifically describes the wishes and conditions for storage, baking and mounting. 9.1 Recommended Reflow Profile Key features of the profile: - Initial Ramp = 1-3°C /sec to 175°C equilibrium - Equilibrium time = 60 to 90 seconds - Ramp to Maximum temperature (255°C) = 3°C /sec Max - Time above liquidus temperature (217°C): 60 – 90 seconds - Device absolute maximum reflow temperature: 255℃ - Possible times of Reflow: ≤3 times 9.
BTA3X Module Specification ➢ 10.
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BTA3X Module Specification ➢ 11. Module Label Specification Label size: Length: 10mm*Width: 10mm Label display: “BTA3X”: Module Part Number (Fixed) “V0025”: the BTA3X firmware version (Variable. V0025 means the firmware is V0.0.2.
BTA3X Module Specification ➢ 12. Certification 12.1 Bluetooth Certification ・Declaration ID: ・QDID: 12.2 Radio Certification BTA3X module has received obtained radio certification of the following countries or regions. NO. Country/Region Certification Standard Certification ID/No. 1 United States FCC ID FCC Part 15.
BTA3X Module Specification ➢ 13.
BTA3X Module Specification Contact Information USE Inc. U.S.E Technology (Shenzhen) Co., Ltd. Head Office: 9/F Technoport Taiju Life Building, 2-16-2 Minamikamata, Ota-ku, Tokyo, Japan Postal Code: 144-0035 Tel: +81-3-5744-4532 Fax: +81-3-5744-4538 E-mail: sales@use-inc.co.jp China Office: Room 312, TianXin Automobile Life Venue, No.46 Meilin Road, FuTian District, ShenZhen, China Postal Code: 518049 Tel: +86-0755-8202-0159 Fax: +86-0755-2533-9389 E-mail: ken.ren@use-inc.co.
FCC Statement Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. The modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device. FCC Radiation Exposure Statement This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment.
Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
Single Module IC Statement This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including interference that may cause undesired operation of the device. Radiation Exposure Statement This modular complies with IC RF radiation exposure limits set forth for an uncontrolled environment.
Cet appareil est conforme aux CNR exemptes de licence d'Industrie Canada . Son fonctionnement est soumis aux deux conditions suivantes : ( 1 ) Ce dispositif ne peut causer d'interférences ; et ( 2 ) Ce dispositif doit accepter toute interférence , y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. Déclaration d'exposition aux radiations Ce module est conforme aux limites d'exposition aux rayonnements RF IC définies pour un environnement non contrôlé. environnement.
OEM INTEGRATION INSTRUCTIONS: This device is intended only for OEM integrators under the following conditions: The module must be installed in the host equipment such that 20 cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the internal on-board antenna that has been originally tested and certified with this module. External antennas are not supported.
concerning the need to notify host manufacturers that further testing is required.3 Explanation: This module meets the requirements of FCC part 15C(15.247)/RSS-247. 2.3 Summarize the specific operational use conditions Describe use conditions that are applicable to the modular transmitter, including for example any limits on antennas, etc. For example, if point-to-point antennas are used that require reduction in power or compensation for cable loss, then this information must be in the instructions.
The module grantee shall provide a notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify the module grantee that they wish to change the antenna trace design.
2.9 Information on test modes and additional testing requirements5 Additional guidance for testing host products is given in KDB Publication 996369 D04 Module Integration Guide. Test modes should take into consideration different operational conditions for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product.
