MAYA-W1 series Host-based modules with Wi-Fi and Bluetooth System integration manual Abstract This document describes the system Integration of MAYA-W1 series short range modules with dualband Wi-Fi 4 and Bluetooth 5.1. These host-based modules are ultra-compact cost-efficient multiradio modules in the MAYA form factor, designed for a wide range of industrial applications. This module series includes variants with or without internal antenna.
MAYA-W1 series - System integration manual Document information Title MAYA-W1 series Subtitle Host-based modules with Wi-Fi and Bluetooth Document type System integration manual Document number UBX-21010495 Revision and date R04 Disclosure Restriction C2-Restricted 4-Jul-2022 Document status explanation Draft For functional testing. Revised and supplementary data will be published later. Objective Specification Target values. Revised and supplementary data will be published later.
MAYA-W1 series - System integration manual Contents Document information ................................................................................................................................ 2 Contents .......................................................................................................................................................... 3 1 System description .......................................................................................................................
MAYA-W1 series - System integration manual 4.4.2 High-speed UART interface ............................................................................................................32 4.5 Other interfaces and notes .....................................................................................................................32 4.6 General high-speed layout guidelines ...................................................................................................33 4.6.
MAYA-W1 series - System integration manual 7.2.1 Referring to the u-blox FCC/ISED certification ID ......................................................................53 7.2.2 Obtaining own FCC/ISED certification ID ....................................................................................53 7.2.3 Antenna requirements ....................................................................................................................54 7.2.
MAYA-W1 series - System integration manual 1 System description 1.1 Overview MAYA-W1 series modules are ultra-compact, multiradio modules with Wi-Fi 4 and Bluetooth 5.1, including variants with or without an internal antenna. MAYA-W1 supports IEEE 802.11a/b/g/n Wi-Fi standards delivering up to 150 Mbps data throughput. With dual band 2.4 / 5 GHz and 40 MHz channel width, the modules can work as a station with different types of AP, as simple Access Point, in P2P communication, or a combination of these.
MAYA-W1 series - System integration manual 1.2.1 Block diagrams Figure 1 shows how the RF section of MAYA-W166 interfaces with the integrated Wi-Fi 4 and Bluetooth 5.1 chipset, external power management circuitry, and RF components in the NXP IW416 SoC. Switch SW1 directs either the Bluetooth or 2.4 GHz Wi-Fi signal from the SoC to the internal module antenna or antenna pin through the Diplexer and (optional) LTE bypass filter (2.4 GHz BPF).
MAYA-W1 series - System integration manual Figure 2 shows how the RF section of the MAYA-W160 and MAYA-161 interfaces with the integrated Wi-Fi 4 and Bluetooth 5.1 chipset, external power management circuitry, and RF components in the NXP IW416 SoC. Similar to MAYA-W166, but in these variants the Bluetooth signal is connected directly to the Bluetooth pin (W161) or U.FL connector (W160) for use with an external antenna. Bluetooth can operate simultaneously with 2.4/5 GHz Wi-Fi. The 2.
MAYA-W1 series - System integration manual 2 Pin definition 2.
MAYA-W1 series - System integration manual 2.3 Pin list No Pin name Pin type Description Alternate functions A1 GND GND Ground - A2 1V8 Power 1.8 V supply - 1V8 A3 SD_DAT[1] I/O SDIO data 1 Tristate VIO_SD A4 SD_CLK I SDIO clock Tristate VIO_SD A5 SD_DAT[3] I/O SDIO data 3 Tristate VIO_SD A6 VIO_SD Power 1.8 V / 3.3 V SDIO supply Tristate VIO_SD A7 3V3 Power 3.3 V supply - 3V3 A8 VIO Power 1.8 V / 2.5 V / 3.
MAYA-W1 series - System integration manual No Pin name Pin type Description Alternate functions Power Down Domain E7 BT_WAKE_ HOST I/O Bluetooth to host wake-up GPIO mode: GPIO[0] Drive low VIO E8 PCM_MCLK I/O PCM clock signal GPIO mode: GPIO[3] Tristate VIO Tristate VIO I2S mode: I2S_CCLK JTAG mode: JTAG_TDO E9 PCM_DIN I/O PCM data in PCM mode: PCM_DOUT GPIO mode: GPIO[5] I2S mode: I2S_DOUT/I2S_DIN F1 NC NC Reserved for PCIe - F2 NC NC Not Connected - F3 RF_CNTL3_ I/O
MAYA-W1 series - System integration manual No Pin name H9 Pin type Description Alternate functions Power Down Domain UART_RTSn O UART RTSn GPIO mode: GPIO[11] Configuration pin: CON[8] Drive high VIO J1 NC NC Reserved for PCIe - J2 NC NC Reserved for PCIe - J3 PDn I Power Down Signal - J4 NC NC Not Connected - J5 NC NC Not Connected - J7 BT_RESET I/O Bluetooth reset GPIO mode: GPIO[15] 1V8 Drive high VIO Drive high VIO Tristate VIO JTAG mode: JTAG_TMS J8 W
MAYA-W1 series - System integration manual 3 Module integration MAYA-W1 must be integrated into the application product together with a Host CPU system. Figure 4 shows a typical integration. Figure 4. MAYA-W1 integration in host system • • • • • • • • • The SDIO provides the main interface for firmware download and Wi-Fi data. The UART interface is used for handling Bluetooth data. Control signals for power down, reset, and host and module wake up are available to control MAYA-W1 from host CPU.
MAYA-W1 series - System integration manual 3.1 Power supply interface MAYA-W1 series power supply pins 3V3, 1V8, VIO, and VIO_SD pins must be sourced by a regulated DC power supply, such as an LDO or SMPS. The appropriate type for your design depends on the main power source of the application. The DC power supply can be taken from any of the following sources: • Switched Mode Power Supply (SMPS) • Low Drop Out (LDO) regulator Module power up must strictly follow the defined power-up sequence.
MAYA-W1 series - System integration manual 3.2 Antenna interfaces MAYA-W1 series modules support three different antenna solutions: • • • • MAYA-W160 includes an integrated and external antenna through U.FL connectors, which makes this module particularly suitable for application products hosted in a metal enclosures where external antennas must be used. MAYA-W161 has two antenna pads that make it ideal for use with SMD antennas mounted on the main PCB. MAYA-W166-00B includes an integrated antenna.
MAYA-W1 series - System integration manual 3.2.3 MAYA-W166-00B MAYA-W166-00B includes a Niche antenna that is printed on the module PCB. The antenna utilizes antenna technology from Proant AB. For proper antenna performance observe the following design considerations. If a metal enclosure is required, use a module variant with either antenna pin or U.FL connector to connect external antennas.
MAYA-W1 series - System integration manual 3.3 System function interfaces 3.3.1 Power-up sequence Figure 7 shows two power-up sequences recommended for MAYA-W1 series module. During the power up of MAYA-W1 series modules, 3V3 shall be enabled first together with or followed by VIO. VIO_SD shall be supplied shortly thereafter, and later followed by 1V8.
MAYA-W1 series - System integration manual 3.3.2 Reset Although external reset is not a prerequisite for correct operation, it can be asserted by the host controller through PDn in the event of any abnormal module behavior. MAYA-W1 series modules are reset to a default operating state by any of the following events: • • Power on (power good 90%) PDn assert: The device is reset when the PDn input pin is < 0.
MAYA-W1 series - System integration manual Configuration bits Pin name Pin number Configuration settings CON[9] WLAN_WAKE_HOST F7 Reserved set to 1 CON[8] UART_RTSn H9 Reserved set to 1 CON[7] UART_CTSn H8 Reserved set to 1 CON[6] RF_CNTL1_P G3 Reserved set to 1, Internal Chip pin not exposed on module CON[5] RF_CNTL3_P F3 Reserved set to 1 CONFIG[1]: E3 CONFIG[0]: D3 Strap value Wi-Fi Bluetooth 10 SDIO UART Others Reserved Reserved Firmware boot options CON[1:0] CONFIG[1:
MAYA-W1 series - System integration manual 3.4 Host interfaces MAYA-W1 series modules support SDIO 3.0 and high-speed UART host interfaces. This means that all Wi-Fi traffic is communicated through SDIO. By setting the appropriate boot option, the highspeed UART interface between the host and the MAYA-W1 module is configured for the Bluetooth traffic. For information about the configuration options for the host interface, see also Configuration pins. 3.4.1 SDIO 3.
MAYA-W1 series - System integration manual • Supports standard baud rates and high throughput up to 4 Mbps. The default baud rate after reset is 115 200 baud and 115 200 baud after the firmware is loaded. The UART interface operation includes: • • Bluetooth firmware upload to the module Bluetooth data Name I/O Description Remarks UART_SOUT O UART TX signal Connect to Host RX UART_SIN I UART RX signal Connect to Host TX UART_RTSn O UART RTS signal Connect to Host CTS.
MAYA-W1 series - System integration manual 3.5.2 GPIO usage GPIOs are used to connect MAYA-W1 to various external devices. Table 15 shows the typical assignments for some of the GPIO pins. Other GPIO signals, described in Table 2, have not yet been assigned by the chip manufacturer. The exact function of these signals is normally dependent on the firmware releases.
MAYA-W1 series - System integration manual 4 Design-in Follow the design guidelines stated in this chapter to optimize the integration of MAYA-W1 series modules in the final application board. 4.1 Overview Although all application circuits must be properly designed, several aspects of the application design require special attention. A list of these points, in order of importance, follow: • • • • • Module antenna connection: o RF_ANT0 and RF_ANT1 pins for MAYA-W161 and U.
MAYA-W1 series - System integration manual Follow the requirements described in in Table 16 and Table 17 to optimize the isolation between the antennas and ensure good application performance. MAYA-166-00B o MAYA-166-00B includes an embedded antenna, which for optimal performance requires the module to be placed on the edge of the host PCB with the “antenna side” closest to the edge.
MAYA-W1 series - System integration manual Item Requirements Remarks Impedance 50 nominal characteristic impedance The impedance of the antenna RF connection must match the 50 impedance of Antenna pins. Frequency Range 2400 - 2500 MHz 5150 - 5850 MHz For 802.11b/g/n/ax and Bluetooth. For 802.11a/n/ac/ax.
MAYA-W1 series - System integration manual 4.2.1.1 Integrated antenna design If integrated antennas are used, the transmission line is terminated by the antennas themselves or by the antenna together with the connected coaxial cable and U.FL plug. Consider the following the guidelines when designing the antenna: • • • • • • • • The antenna design process should commence at the same time as the mechanical design of the product.
MAYA-W1 series - System integration manual The most common transmission line implementation is the coplanar microstrip, as shown in Figure 8. Figure 8: Transmission line trace design Follow these recommendations to design a 50 transmission line correctly: • • • • • • • • • Designers must provide enough clearance from surrounding traces and ground in the same layer. In general, the trace to ground clearance should be at least twice that of the trace width.
MAYA-W1 series - System integration manual Figure 9 shows a trace and ground design example. From top left to bottom right: layer 1 mirrored, layer 1, layer 2, layer 3, layer 4, and so on. Figure 9: RF trace and ground design example Figure 10 shows typical artwork implementing a coplanar microstrip on an 8-layer PCB.
MAYA-W1 series - System integration manual Figure 11 shows layout of pads for U.FL connector. Consider especially the GND clearance under the signal pad. Figure 11: U.FL connector layout, top layer to the left and inner layer 1 to the right 4.3 Supply interfaces 4.3.1 Module supply design Although the GND pins are internally connected, it is advisable to connect all available ground pins on the application board to solid ground with a good (low impedance) connection to external ground.
MAYA-W1 series - System integration manual A Switched Mode Power Supply (SMPS) is generally recommended for converting the main supply to the module supply when the voltage difference is relatively high. In these circumstances, the use of an SMPS dissipate less power and subsequently generates less power dissipation and heat than an LDO. See also Regulated DC power supply. By contrast, an LDO is generally simpler to use and does not generate the amount of noise an SMPS might.
MAYA-W1 series - System integration manual It is advisable to route all signals in the bus so that they have the same length and the appropriate grounding in the surrounding layers. The total bus length should be kept to a minimum. To minimize crosstalk with other parts of the circuit, the layout of the SDIO bus should be designed with adequate isolation between the signals, clock, and surrounding busses/traces. Implement an undisrupted return-current path in close vicinity to the signal traces.
MAYA-W1 series - System integration manual 4.4.2 High-speed UART interface The high-speed UART interface for the MAYA-W1 complies with the HCI UART Transport layer and uses the settings shown in Table 19.
MAYA-W1 series - System integration manual 4.6 General high-speed layout guidelines These guidelines describe best practices for the layout of all high-speed busses on MAYA-W1. Designers should prioritize the layout of higher speed busses. Low frequency signals, other than those with high-impedance traces, are generally not critical to the layout. ⚠ Low frequency signals with high-impedance traces (such as signals driven by weak pull resistors) may be affected by crosstalk.
MAYA-W1 series - System integration manual • • • • ⚠ Hi-speed busses are not allowed to change reference plane. If a change to the reference plane is unavoidable, some capacitors should be added in the area to provide a low impedance return path through the various reference planes. Trace routing should maintain a distance that is greater than 3*W from the edge of the ground plane routing. Power planes should maintain a safe distance from the edge of the PCB.
MAYA-W1 series - System integration manual 4.8 Thermal guidelines MAYA-W1 series modules are designed to operate from -40 °C to +85 °C at an ambient temperature inside the enclosure box. The board generates heat during high loads that must be dissipated to sustain the lifetime of the components. The improvement of thermal dissipation in the module decreases its internal temperature and consequently increases the long-term reliability of device applications operating at high ambient temperatures.
MAYA-W1 series - System integration manual 4.9 ESD guidelines MAYA-W1 modules are manufactured using a highly automated process, which complies with IEC61340-5-1 [6] (STM5.2-1999 Class M1 devices) standard. Customer on-site manufacturing processes that satisfy the basic ESD control program are sufficient to comply with the necessary precautions8 for handling the modules. Table 21 describes the target ESD ratings of the MAYA-W1 pins – subject to module qualification.
MAYA-W1 series - System integration manual 4.10 Design-in checklists 4.10.1 Schematic checklist MAYA-W1 module pins have been properly numbered and designated in the schematic (including thermal pins). See Pin list. Power supply design complies with the voltage supply requirements in Table 3 and the power supply requirements described in the MAYA-W1 data sheet [1]. The Power-up sequence has been properly implemented Adequate bypassing has been included in front of each power pin.
MAYA-W1 series - System integration manual 5 Software This chapter describes the available software options for MAYA-W1 series modules, which are based on the NXP IW416 chipset. The drivers and firmware required to operate MAYA-W1 series modules are developed by NXP and are pre-integrated into the Linux BSP for NXP i.MX processors [12] and the MCUXpresso SDK for NXP MCU devices [13]. 5.
MAYA-W1 series - System integration manual 5.2.1 Yocto meta layer Yocto is an open-source project aimed at helping the development of custom Linux-based systems for embedded products. It provides a complete development environment with tools, documentation, and metadata like recipes, classes, and configuration. Yocto is based on the OpenEmbedded build system. A Yocto/OpenEmbedded meta layer “meta-ublox-modules” is provided by u-blox for all host-based modules.
MAYA-W1 series - System integration manual Figure 14 shows the basic architecture of the Linux open source, Wi-Fi driver (mxm_mwifiex), which is a unified driver for all supported NXP Wi-Fi chipsets. The driver allows simple migration and forward compatibility with future devices. Driver sources can be used or ported for other non-NXP host platforms. Bluetooth uses the Linux BlueZ host stack through the HCI UART interface of the module, but other stacks can also be supported.
MAYA-W1 series - System integration manual 5.4.2 Building the Wi-Fi driver A (cross-)toolchain for the target system is required and configured kernel sources must be available and prepared for building external kernel modules. Make sure that CONFIG_CFG80211 is enabled in the kernel configuration. To prepare fresh kernel sources, configure the kernel and run make modules_prepare in the kernel source directory.
MAYA-W1 series - System integration manual 5.4.5 Bluetooth driver The standard hci_uart driver from the Linux kernel is used for the Bluetooth HCI UART interface. Make sure to enable CONFIG_BT_HCIUART and CONFIG_BT_HCIUART_H4 in the kernel configuration. 5.4.
MAYA-W1 series - System integration manual Table 24 describes the functions of the Wi-Fi interfaces. Interface Function mlan0 Network interface used for station mode functionality. Typically used with wpa_supplicant. uap0 Network interface used for access-point functionality. Typically used with hostapd. wfd0 Network interface used for P2P functionality. Can operate in both group owner (GO) and group client (GC) modes.
MAYA-W1 series - System integration manual The Wi-Fi TX power levels are configured with the txpwrlimit_2g_cfg_set and txpwrlimit_5g_cfg_set data structures defined in the txpwrlimit_cfg.conf configuration file. The configuration file allows integrators to fine tune specific transmit power levels for the Wi-Fi radio, including: • • • • ☞ Band (2.
MAYA-W1 series - System integration manual The mapping of multiple wireless data rates into ModulationGroup values is shown in Table 26. ModulationGroup Mode Bandwidth [MHz] Description 0 802.11b 20 CCK (1,2,5.5,11 Mbps) 1 802.11g 20 OFDM (6,9,12,18 Mbps) 2 OFDM (24,36 Mbps) 3 OFDM (48,54 Mbps) 4 802.
MAYA-W1 series - System integration manual ☞ The transmit power limit configurations for 40 MHz operation in the 5 GHz band must be specified for all related 20 MHz channels. For example, the 40 MHz channel at the center frequency 5190 MHz (20 MHz channels 36+40) uses the transmit power limits from HT40 values in the entry with TLVChanNum=36 (secondary channel above primary channel) or TLVChanNum=40 (secondary channel below primary channel), which should be equal.
MAYA-W1 series - System integration manual Bluetooth LE transmit power level can be set using the vendor specific HCI command HCI_CMD_BLE_WRITE_TRANSMIT_POWER_LEVEL, as shown in the following example: # hcitool -i hci0 cmd 0x3F 0x87 # set BLE TX power level to 10 dBm: hcitool -i hci0 cmd 0x3F 0x87 0x0A ☞ Bluetooth LE TX power setting will be cleared with HCI reset. A maximum of TX power level of 10 dBm can be configured. 5.6.
MAYA-W1 series - System integration manual ☞ The Wi-Fi driver automatically assigns locally unique MAC addresses to any additional Wi-Fi network interfaces, which are derived from the radio’s primary Wi-Fi station interface MAC address. The use of reserved unique MAC addresses is recommended to avoid possible collisions with the MAC addresses of other modules. The MAC addresses of the interfaces can be configured through an init_cfg.
MAYA-W1 series - System integration manual 6 ⚠ Handling and soldering MAYA-W1 series modules are Electrostatic Sensitive Devices that demand the observance of special handling precautions against static damage. Failure to observe these precautions can result in severe damage to the product. 6.1 ESD handling precautions As the risk of electrostatic discharge in the RF transceivers and patch antennas of the module is of particular concern, standard ESD safety practices are prerequisite. See also Figure 15.
MAYA-W1 series - System integration manual 6.3 Reflow soldering process ☞ MAYA-160 is approved for one-time processes approved for two-time reflow processes. only. MAYA-161 and MAYA-166 are MAYA-W1 modules are surface mounted devices supplied on a multi-layer FR4-type PCB with goldplated connection pads. The modules are produced in a lead-free process using lead-free soldering paste.
MAYA-W1 series - System integration manual 6.3.1 Cleaning Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process. • • • Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pins.
MAYA-W1 series - System integration manual 7 Regulatory compliance 7.1 General requirements MAYA-W1 series modules are designed to comply with the regulatory demands of Federal Communications Commission (FCC), Innovation, Science and Economic Development Canada (ISED)10 and the CE mark11. This chapter contains instructions on the process needed for an integrator when including the MAYA-W1 module into an end-product.
MAYA-W1 series - System integration manual The evaluation of the end product shall be performed with the MAYA-W1 module installed and operating in a way that reflects the intended end product use case. The upper frequency measurement range of the end product evaluation is the 10th harmonic of 5.8 GHz as described in KDB 996369 D04.
MAYA-W1 series - System integration manual ☞ ⚠ For modules where the FCC ID / ISED certification ID is printed on the label, the integrator must replace the module label with a new label containing the new FCC/ISED ID. For a description of the labeling requirements, see also the MAYA-W1 series data sheet [1]. It is the responsibility of the integrator to comply with any upcoming regulatory requirements. 7.2.
MAYA-W1 series - System integration manual • • • • • • The configuration of the modular transmitter when installed into the host product must be within the authorization of the modular transmitter at all times and cannot be changed to include unauthorized modes of operation through accessible interfaces of the host product. The Wi-Fi Tx output power limits must be followed.
MAYA-W1 series - System integration manual Channel number Channel center frequency [MHz] Allowed channels 1 – 11 2412 – 2462 Yes 12 – 13 2467 – 2472 No 36 – 48 5180 – 5240 Yes 52 – 64 5260 – 5320 Yes13 100 – 116 5500 – 5580 Yes13 120 – 128 5600 – 5640 No 132 – 144 5660 – 5720 Yes13 149 – 165 5745 – 5825 Yes Remarks Canada (ISED): Devices are restricted to indoor operation only and the end product must be labelled accordingly.
MAYA-W1 series - System integration manual FCC end product labeling In accordance with 47 CFR § 15.19, the end product shall bear the following statement in a conspicuous location on the device: This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation.
MAYA-W1 series - System integration manual 7.3.2 CE Equipment classes In accordance with Article 1 of Commission Decision 2000/299/EC 15, MAYA-W1 is defined as either Class-1 or Class-2 radio equipment, the end-product integrating MAYA-W1 inherits the equipment class of the module. ☞ ☞ ⚠ Guidance on end product marking, according to the RED can be found at: http://ec.europa.
MAYA-W1 series - System integration manual 8 Product testing 8.1 u-blox in-line production testing As part of our focus on high quality products, u-blox maintain stringent quality controls throughout the production process. This means that all units in our manufacturing facilities are fully tested and that any identified defects are carefully analyzed to improve future production quality.
MAYA-W1 series - System integration manual 8.2 OEM manufacturer production test As all u-blox products undergo thorough in-series production testing prior to delivery, OEM manufacturers do not need to repeat any firmware tests or measurements that might otherwise be necessary to confirm RF performance. Testing over analog and digital interfaces is also unnecessary during an OEM production test.
MAYA-W1 series - System integration manual Appendix A Glossary Abbreviation Definition AEC Automotive Electronics Council AP Access Point API Application Programming Interface ATE Automatic Test Equipment BT Bluetooth CDM Charged Device Model CE European Conformity CTS Clear to Send DC Direct Current DDR Double Data Rate DFS Dynamic Frequency Selection DHCP Dynamic Host Configuration Interface EDR Enhanced Data Rate EEPROM Electrically Erasable Programmable Read-Only Memory EI
MAYA-W1 series - System integration manual Abbreviation Definition PCB Printed Circuit Board PCI Peripheral Component Interconnect PCIe PCI Express PCM Pulse-code modulation PHY Physical layer (of the OSI model) PMU Power Management Unit RF Radio Frequency RSDB Real Simultaneous Dual Band RST Request to Send SDIO Secure Digital Input Output SMD Solder Mask Defined SMPS Switching Mode Power Supply SMT Surface-Mount Technology SSID Service Set Identifier STA Station TBD To be
MAYA-W1 series - System integration manual Related documents [1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] [13] [14] [15] [16] [17] ☞ MAYA-W1 series data sheet, UBX-21006380 Packaging information reference, UBX-14001652 u-blox Limited Use License Agreement, LULA-M IEC EN 61000-4-2 - Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement techniques – Electrostatic discharge immunity test ETSI EN 301 489-1 - Electromagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagne
MAYA-W1 series - System integration manual Revision history Revision Date Name Comments R01 21-Jul-2021 lber, mzes Initial release. R02 04-Jan-2022 lber, mzes, mape Editorial changes, including content restructuring in several sections throughout the document. SDIO line Pull-up resistor recommendation added in SDIO 3.0 interface and SDIO 3.0. Aligned Pin list with the MAYA-W1 data sheet. Revised Module integration.
