BMD-360 Stand-alone Bluetooth 5.1 low energy and IEEE 802.15.4 module Data sheet Abstract This technical data sheet describes the BMD-360 stand-alone Bluetooth® low energy and IEEE 802.15.4 module. The OEMs can embed their own application on top of the integrated Bluetooth low energy stack using Nordic SDK integrated development environment (IDE). www.u-blox.
BMD-360 - Data sheet Document information Title BMD-360 Subtitle Stand-alone Bluetooth 5.1 low energy and IEEE 802.15.4 module Document type Data sheet Document number UBX-19039466 Revision and date R03 21-Oct-2019 Disclosure restriction Product status Corresponding content status Functional sample Draft For functional testing. Revised and supplementary data will be published later. In development / Prototype Objective specification Target values.
BMD-360 - Data sheet Contents Document information ................................................................................................................................ 2 Contents .......................................................................................................................................................... 3 1 Functional description ......................................................................................................................... 5 1.
BMD-360 - Data sheet 9.1.2 RF exposure .......................................................................................................................................21 9.2 Canada (ISED) (pending approval) .........................................................................................................21 9.2.1 Labeling and user information requirements .............................................................................21 9.2.2 RF exposure .....................................
BMD-360 - Data sheet 1 Functional description The BMD-360 is a powerful, highly flexible, ultra-low power Bluetooth 5.1 and IEEE 802.15.4 (Thread and Zigbee) module based on the nRF52811 SoC from Nordic Semiconductor. With an Arm® Cortex® M4 CPU, embedded 2.4GHz transceiver, and integrated antenna, it provides a complete RF solution with no additional RF design, allowing faster time to market.
BMD-360 - Data sheet • • • • • • • • • • • Access Control Internet of Things Home Health Care Advanced Remote Controls Smart Energy Management Low-Power Sensor Networks Interactive Entertainment Key Fobs Environmental Monitoring Hotel Automation Office Automation 1.3 Block diagram BMD-360 Bluetooth 5 Low Energy SoC Module nRF52811-QFAx 24 kB RAM SWD Debug & Programming Core LDO DC/DC Buck Regulator DC-DC Inductor Accel Address Resolver ARM Cortex-M4 @ 64MHz 2.
BMD-360 - Data sheet Detail Description Modulations GFSK at 1 Mbps and 2 Mbps, QPSK at 250 Kbps Receiver sensitivity -97 dBm (Bluetooth low energy 1M mode), -104 dBm (Coded PHY mode) Antenna Integrated (3 dBi peak) Current consumption TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled 7.0 mA, 4.6 mA TX only @ +4 dBm, 0 dBm 15.4 mA, 10.1 mA RX only @ 1 Mbps @ 3V, DCDC enabled 4.6 mA RX only @ 1 Mbps 10.0 mA RX only @ 2 Mbps @ 3V, DCDC enabled 5.2 mA RX only @ 2 Mbps 11.
BMD-360 - Data sheet 2 Pin definition 2.1 Pin assignment The BMD-360 shares an identical pin-out with the BMD-300, BMD-301, and BMD-330. This pin-out is also a subset of the BMD-340/341 footprint, allowing a single design to support any of these modules. Figure 2: BMD-360 Pin assignment (Top view) No. Name I/O Description 1 GND Power Electrical Ground 2 GND Power Electrical Ground 3 GND Power Electrical Ground 4 GND Power Electrical Ground 5 GND Power Electrical Ground 6 P0.
BMD-360 - Data sheet No. Name I/O Description nRF52 pin Remarks 19 P0.03 I/O GPIO/AIN1 P0.03 Pin is analog capable 20 P0.04 I/O GPIO/AIN2 P0.04 Pin is analog capable 21 P0.05 I/O GPIO/AIN3 P0.05 Pin is analog capable 22 P0.06 I/O GPIO P0.06 23 P0.07 I/O GPIO P0.07 24 P0.08 I/O GPIO P0.08 25 P0.09 I/O GPIO P0.09 26 P0.10 I/O GPIO P0.10 27 P0.11 I/O GPIO P0.11 28 P0.12 I/O GPIO P0.
BMD-360 - Data sheet 3 Electrical specifications ⚠ Stressing the device above one or more of the ratings listed in the Absolute maximum rating section may cause permanent damage. These are stress ratings only. Operating the module at these or at any conditions other than those specified in the Operating conditions section of this document should be avoided. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
BMD-360 - Data sheet • • All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced through the PPI at the same time is limited by the number of GPIOTE channels All pins can be individually configured to carry serial interface or quadrature demodulator signals Symbol Parameter Min. Typ. Max. Unit VIH Input High Voltage 0.7 x VCC - VCC V VIL Input Low Voltage GND - 0.3 x VCC V VOH Output High Voltage VCC − 0.
BMD-360 - Data sheet 3.6.1 32.768 kHz crystal (LFXO) (preliminary) Symbol Parameter Typ. Max. Unit FNOM_LFXO Crystal frequency 32.768 - kHz FTOL_LFXO_BLE Frequency tolerance, Bluetooth low energy applications - ±500 ppm fTOL_LFXO_ANT Frequency Tolerance, ANT applications - ±50 ppm CL_LFXO Load Capacitance - 12.5 pF C0_LFXO Shunt Capacitance - 2 pF RS_LFXO Equivalent series resistance - 100 kΩ Cpin Input Capacitance on XL1 & XL2 pads 4 - pF Table 5: 32.
BMD-360 - Data sheet 4 Firmware u-blox recommends that projects for the BMD-360 utilize Nordic Semiconductor’s SDK, DFU, and examples and the nRF52811 tools for any new development. This will allow access to the very latest Bluetooth support from Nordic Semiconductor and provide an ongoing path as new features are released. 4.1 Factory image The BMD-360 module is not loaded with a factory firmware image. 4.2 SoftDevices Nordic Semiconductor protocol stacks are known as SoftDevices.
BMD-360 - Data sheet 5 Mechanical specifications 5.1 Dimensions Figure 3: BMD-360 mechanical drawing 5.2 Recommended PCB land pads Figure 4: Recommended PCB land pads ☞ The RF Keep-out area extends vertically to the board edge.
BMD-360 - Data sheet 5.3 Module marking The labels of the BMD-360 modules include important product information as described in this section. Figure 5 illustrates the label of the BMD-360 modules, which includes the u-blox logo, product version, product name, Bluetooth address, and certification numbers.
BMD-360 - Data sheet 6 RF design notes 6.1 Recommended RF layout and ground plane For the BMD-360, the integrated antenna requires a suitable ground plane to radiate effectively. The area under and extending out from the antenna portion of the module should be kept clear of copper and other metal. The module should be placed at the edge of the PCB with the antenna edge facing out. Reducing the ground plane from that shown in Figure 6 will reduce the effective radiated power.
BMD-360 - Data sheet 7 Antenna patterns Antenna patterns are based on the BMD-300 Evaluation Kit with a ground plane size of 82 mm x 56 mm. The BMD-300 module was replaced with a BMD-360 module. The X-Y-Z orientation is shown in Figure 7: Figure 7: BMD-360 Evaluation kit X -Y-Z orientation 7.1 X-Y plane X Y Figure 8: X-Y Plane Antenna Pattern ☞ The outer-most ring is +5 dB.
BMD-360 - Data sheet 7.2 Y-Z plane Y Z Figure 9: Y-Z Plane Antenna Pattern ☞ The outer-most ring is +5 dB. Each division is -5 dB. 7.3 Z-X plane Z X Figure 10: Z-X Plane Antenna Pattern ☞ The outer-most ring is +5 dB. Each division is -5 dB.
BMD-360 - Data sheet 8 BMD-360 evaluation development kit The BMD-360-EVAL is a full featured evaluation board that provides a complete I/O pin out to headers, on-board programming and debugging, 32.768 kHz crystal, power & virtual COM port over USB, four user LEDs, and four user buttons. The evaluation boards also provide the option to be powered from a CR2032 coin cell battery and have current sense resistors and headers to allow for convenient current measurements.
BMD-360 - Data sheet 9 Qualification and approvals 9.1 United States (FCC) (pending approval) The BMD-360 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Parts 15.212 and 15.247.
BMD-360 - Data sheet 9.1.2 RF exposure All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC).
BMD-360 - Data sheet puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. 9.2.2 RF exposure All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands).
BMD-360 - Data sheet 9.5 Bluetooth qualification (pending) The Bluetooth SIG maintains the Bluetooth Specification, and ensures that products are properly tested and comply with the Bluetooth license agreements. Companies that list products with the Bluetooth SIG are required to be members of the SIG and submit the listed fees. Refer to this link for details: https://www.bluetooth.
BMD-360 - Data sheet 10 Environmental 10.1 RoHS The BMD-360 module is in compliance with Directive 2011/65/EU, 2015/863/EU of the European Parliament and the Council on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 10.2 REACH Rigado’s modules listed below do not contain the 201 SVHC (Substance of Very High Concern), as defined by Directive EC/1907/2006 Article according to REACH Annex XVII. 10.
BMD-360 - Data sheet 11 Product handling 11.1 Packaging 11.2 Reel packaging Modules are packaged on 330 mm reels loaded with 1000 modules. Each reel is placed in an antistatic bag with a desiccant pack and humidity card and placed in a 340 x 350 x 65 mm box. An antistatic warning and reel label are adhered to the outside of the bag. Figure 12 – Reel cartons 11.3 Carrier tape dimensions Figure 13 – Carrier tape dimensions 11.
BMD-360 - Data sheet 11.
BMD-360 - Data sheet 12 Labeling and ordering information 12.1 Batch Label Figure 15 shows an example of the layout and contents of the batch label. The label is affixed to reels, sealed bags, and individual packing cartons (inner cartons). Figure 15: Batch label example 12.2 Multipack label Figure 16 shows an example of the layout and contents of the multipack label. The label is affixed to shipping parcels (outer cartons).
BMD-360 - Data sheet Figure 16: Multipack label example 12.
BMD-360 - Data sheet 13 Life support and other high-risk use warning This product is not designed nor intended for use in a life support device or system, nor for use in other fault-intolerant, hazardous or other environments requiring fail-safe performance, such as any application in which the failure or malfunction of the product could lead directly or indirectly to death, bodily injury, or physical or property damage (collectively, “High-Risk Environments”).
BMD-360 - Data sheet Related documents [1] [2] ☞ Nordic Semiconductor, nRF52811 Product Specification Nordic Semiconductor, nRF5 Software Development Kit For regular updates to u-blox documentation and to receive product change notifications, register on our homepage (www.u-blox.com). Revision history Revision Date 0.5 15-Apr-2019 Preliminary release for engineering. 0.6 01-Jul-2019 Corrected typos. Updated Nordic Semiconductor documentation link. Updated images.
BMD-360 - Data sheet Contact For complete contact information, visit us at www.u-blox.com. u-blox Offices North, Central and South America u-blox America, Inc. Phone: E-mail: +1 703 483 3180 info_us@u-blox.com Regional Office West Coast: Phone: E-mail: +1 408 573 3640 info_us@u-blox.com Headquarters Europe, Middle East, Africa Asia, Australia, Pacific u-blox AG Phone: +65 6734 3811 E-mail: info_ap@u-blox.com Support: support_ap@u-blox.com Phone: +41 44 722 74 44 E-mail: info@u-blox.
